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Image Part Number D.S Description Package Category Prices / Stock Model Action
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5-794630-0 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Positions 20 | Number of Rows 2 | Number of Power Positions 20 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Multiple Contact Types Other 5-794630-0 1 Download Model
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5-794630-2 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Power Positions 22 | Number of Positions 22 | Contact Features: PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Multiple Contact Types Without | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | PCB Contac Other 5-794630-2 1 Download Model
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5-794637-2 TE Connectivity
1 Configuration Features: Number of Rows 2 | Number of Power Positions 22 | Number of Positions 22 | PCB Mount Orientation Vertical | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material G Other 5-794637-2 1 Download Model
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5-794636-0 TE Connectivity
1 Configuration Features: Number of Rows 2 | Number of Positions 20 | PCB Mount Orientation Vertical | Number of Power Positions 20 | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area Other 5-794636-0 1 Download Model
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5-794630-4 TE Connectivity
1 Configuration Features: Number of Rows 2 | Number of Power Positions 24 | PCB Mount Orientation Vertical | Number of Positions 24 | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Materi Other 5-794630-4 1 Download Model
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5-794636-4 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Positions 24 | Number of Power Positions 24 | Number of Rows 2 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Current Rating (Max) 5 AMP | Contact Ty Other 5-794636-4 1 Download Model
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5-794638-0 TE Connectivity
1 Configuration Features: PCB Mount Orientation Vertical | Number of Positions 20 | Number of Rows 2 | Number of Power Positions 20 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Dimensions: Wire S Other 5-794638-0 1 Download Model
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5-794677-4 TE Connectivity
1 Configuration Features: Number of Positions 24 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 24 | Number of Signal Positions 0 | Contact Features: Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Mater Other 5-794677-4 1 Download Model
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5-794619-2 TE Connectivity
1 Configuration Features: Number of Power Positions 22 | Number of Positions 22 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Th Other 5-794619-2 1 Download Model
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5-794618-4 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 24 | Number of Rows 2 | Number of Power Positions 24 | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Retention Within Housing Without | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 150 Other 5-794618-4 1 Download Model
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5-794629-4 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Power Positions 24 | Number of Positions 24 | Contact Features: PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plat Other 5-794629-4 1 Download Model
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5-794628-0 TE Connectivity
1 Configuration Features: Number of Positions 20 | Number of Power Positions 20 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Platin Other 5-794628-0 1 Download Model
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5-794618-0 TE Connectivity
1 Configuration Features: Number of Rows 2 | Number of Positions 20 | Number of Power Positions 20 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Mating Area Plating Materi Other 5-794618-0 1 Download Model
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5-794682-4 TE Connectivity
1 PCB Mount Header, Vertical, Wire-to-Board, 24 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Micro MATE-N-LOK Other 5-794682-4 1 Download Model
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5-794678-0 TE Connectivity
1 20P MICRO MNL ASSY,R/A,THRU,LF Other 5-794678-0 1 Download Model
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5-794677-0 TE Connectivity
1 Configuration Features: Number of Positions 20 | Number of Power Positions 20 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area Plating Material Thickne Other 5-794677-0 1 Download Model
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5-794682-0 TE Connectivity
1 20P MICRO MNL ASSY,VRT,THRU,L Other 5-794682-0 1 Download Model
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5-794680-4 TE Connectivity
1 PCB Mount Header, Vertical, Wire-to-Board, 24 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Tin, Through Hole - Solder, Power, Micro MATE-N-LOK Other 5-794680-4 1 Download Model
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5-794618-2 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 22 | Number of Rows 2 | Number of Positions 22 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area Platin Other 5-794618-2 1 Download Model
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5-794677-2 TE Connectivity
1 Connector Header Through Hole, Right Angle 22 position 0.118" (3.00mm) Other 5-794677-2 1 Download Model
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5-794627-4 TE Connectivity
1 Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 24 | Number of Power Positions 24 | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Retention Within Housing Without | Multiple Contact Types W Other 5-794627-4 1 Download Model
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5-794632-4 TE Connectivity
1 PCB Mount Header, Vertical, Wire-to-Board, 24 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Micro MATE-N-LOK Other 5-794632-4 1 Download Model
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5-794632-0 TE Connectivity
1 PCB Mount Header, Vertical, Wire-to-Board, 20 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Micro MATE-N-LOK Other 5-794632-0 1 Download Model
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5-794626-0 TE Connectivity
1 PCB Mount Header, Right Angle, Wire-to-Board, 20 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Surface Mount, Power, Micro MATE-N-LOK Other 5-794626-0 1 Download Model
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5-794638-4 TE Connectivity
1 Configuration Features: Number of Rows 2 | Number of Positions 24 | PCB Mount Orientation Vertical | Number of Power Positions 24 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Cont Other 5-794638-4 1 Download Model
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