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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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5-794636-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 24 | Number of Power Positions 24 | Number of Rows 2 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Current Rating (Max) 5 AMP | Contact Ty | Other | 5-794636-4 |
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5-794638-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 20 | Number of Rows 2 | Number of Power Positions 20 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Dimensions: Wire S | Other | 5-794638-0 |
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5-794677-4
TE Connectivity
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1 | Configuration Features: Number of Positions 24 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 24 | Number of Signal Positions 0 | Contact Features: Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Mater | Other | 5-794677-4 |
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5-794618-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 24 | Number of Rows 2 | Number of Power Positions 24 | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Retention Within Housing Without | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 150 | Other | 5-794618-4 |
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5-794619-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 22 | Number of Positions 22 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Th | Other | 5-794619-2 |
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5-794618-0
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 20 | Number of Power Positions 20 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Mating Area Plating Materi | Other | 5-794618-0 |
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5-794682-4
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 24 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Micro MATE-N-LOK | Other | 5-794682-4 |
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5-794630-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 20 | Number of Rows 2 | Number of Power Positions 20 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Multiple Contact Types | Other | 5-794630-0 |
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5-794630-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Power Positions 22 | Number of Positions 22 | Contact Features: PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Multiple Contact Types Without | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | PCB Contac | Other | 5-794630-2 |
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5-794637-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 22 | Number of Positions 22 | PCB Mount Orientation Vertical | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material G | Other | 5-794637-2 |
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5-794636-0
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 20 | PCB Mount Orientation Vertical | Number of Power Positions 20 | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area | Other | 5-794636-0 |
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5-794677-2
TE Connectivity
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1 | Connector Header Through Hole, Right Angle 22 position 0.118" (3.00mm) | Other | 5-794677-2 |
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5-794627-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 24 | Number of Power Positions 24 | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Retention Within Housing Without | Multiple Contact Types W | Other | 5-794627-4 |
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5-794629-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Power Positions 24 | Number of Positions 24 | Contact Features: PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plat | Other | 5-794629-4 |
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5-794628-0
TE Connectivity
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1 | Configuration Features: Number of Positions 20 | Number of Power Positions 20 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Platin | Other | 5-794628-0 |
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5-794632-0
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 20 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Micro MATE-N-LOK | Other | 5-794632-0 |
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5-794632-4
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 24 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Micro MATE-N-LOK | Other | 5-794632-4 |
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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5-794630-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 24 | PCB Mount Orientation Vertical | Number of Positions 24 | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Materi | Other | 5-794630-4 |
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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5-794677-0
TE Connectivity
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1 | Configuration Features: Number of Positions 20 | Number of Power Positions 20 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area Plating Material Thickne | Other | 5-794677-0 |
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5-794680-4
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 24 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Tin, Through Hole - Solder, Power, Micro MATE-N-LOK | Other | 5-794680-4 |
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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5-794618-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 22 | Number of Rows 2 | Number of Positions 22 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area Platin | Other | 5-794618-2 |
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5-794626-0
TE Connectivity
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1 | PCB Mount Header, Right Angle, Wire-to-Board, 20 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Surface Mount, Power, Micro MATE-N-LOK | Other | 5-794626-0 |
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5-794620-4
TE Connectivity
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1 | Connector Header Through Hole, Right Angle 24 position 0.118" (3.00mm) | Other | 5-794620-4 |
3
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5-794638-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 24 | PCB Mount Orientation Vertical | Number of Power Positions 24 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Cont | Other | 5-794638-4 |
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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5-794678-0
TE Connectivity
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1 | 20P MICRO MNL ASSY,R/A,THRU,LF | Other | 5-794678-0 |
3
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