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5-794620-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 24 | Number of Rows 2 | Number of Positions 24 | Contact Features: Contact Mating Area Plating Material Gold | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | PCB Contac | Check Price & Stock |
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5-794633-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 24 | Number of Rows 2 | Number of Power Positions 24 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Multiple Contact Types Without | Contact Mating Area Plating | Check Price & Stock |
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5-794681-0
TE Connectivity
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1 | Configuration Features: Number of Positions 20 | Number of Rows 2 | PCB Mount Orientation Vertical | Number of Power Positions 20 | Number of Signal Positions 0 | Contact Features: Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Mat | Check Price & Stock |
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5-794636-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 22 | Number of Power Positions 22 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Type Pin | | Check Price & Stock |
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5-794629-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 22 | PCB Mount Orientation Right Angle | Number of Power Positions 22 | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | P | Check Price & Stock |
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5-794682-4
TE Connectivity
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1 | Configuration Features: Number of Signal Positions 0 | Number of Positions 24 | Number of Power Positions 24 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Type Pin | Contact Mating Area Plating Mat | Check Price & Stock |
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5-794637-0
TE Connectivity
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1 | Configuration Features: Number of Positions 20 | PCB Mount Orientation Vertical | Number of Power Positions 20 | Number of Rows 2 | Contact Features: Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | Dimensions: Row-to | Check Price & Stock |
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5-794632-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 22 | Number of Rows 2 | Number of Positions 22 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 | Check Price & Stock |
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5-794631-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 24 | Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 24 | Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .38 MICM | Dimensions: Row-to | Check Price & Stock |
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5-794631-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 24 | Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 24 | Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness .38 MICM | Dimensions: Row-to | Check Price & Stock |
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5-794620-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 22 | Number of Rows 2 | Number of Positions 22 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area Platin | Check Price & Stock |
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5-794633-0
TE Connectivity
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1 | Configuration Features: Number of Positions 20 | Number of Rows 2 | PCB Mount Orientation Vertical | Number of Power Positions 20 | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | | Check Price & Stock |
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5-794680-0
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 20 | Number of Positions 20 | PCB Mount Orientation Vertical | Number of Signal Positions 0 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material | Check Price & Stock |
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5-794619-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 20 | PCB Mount Orientation Right Angle | Number of Positions 20 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Tin | PCB Contact Ter | Check Price & Stock |
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5-794681-0
TE Connectivity
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1 | Configuration Features: Number of Positions 20 | Number of Rows 2 | PCB Mount Orientation Vertical | Number of Power Positions 20 | Number of Signal Positions 0 | Contact Features: Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Mat | Check Price & Stock |
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5-794678-4
TE Connectivity
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1 | Configuration Features: Number of Positions 24 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Power Positions 24 | Contact Features: PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Gold | PCB Contact Ter | Check Price & Stock |
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5-794633-0
TE Connectivity
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1 | Configuration Features: Number of Positions 20 | Number of Rows 2 | PCB Mount Orientation Vertical | Number of Power Positions 20 | Contact Features: Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | | Check Price & Stock |
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5-794636-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 22 | Number of Power Positions 22 | PCB Mount Orientation Vertical | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Type Pin | | Check Price & Stock |
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5-794638-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 22 | Number of Rows 2 | Number of Power Positions 22 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Mate | Check Price & Stock |
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
5-794638-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 22 | Number of Rows 2 | Number of Power Positions 22 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Mate | Check Price & Stock |
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
5-794632-0
TE Connectivity
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1 | Configuration Features: Number of Positions 20 | Number of Rows 2 | Number of Power Positions 20 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | PCB Contact Termination Area Plating Material Thickn | Check Price & Stock |
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
5-794628-4
TE Connectivity
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1 | Configuration Features: Number of Positions 24 | PCB Mount Orientation Right Angle | Number of Power Positions 24 | Number of Rows 2 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Check Price & Stock |
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
5-794626-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 24 | Number of Positions 24 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Multiple Contact Types Without | Contact Retention Within Housing Without | Dimensions: PCB | Check Price & Stock |
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
5-794620-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 22 | Number of Rows 2 | Number of Positions 22 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area Platin | Check Price & Stock |
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
5-794680-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Signal Positions 0 | Number of Positions 24 | PCB Mount Orientation Vertical | Number of Power Positions 24 | Contact Features: Contact Type Pin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Mu | Check Price & Stock |
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Download Model | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||