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Image Part Number D.S Description Package Category Prices / Stock Model Action
Image Part Number D.S Description Package Category Prices / Stock Model Action
Part Image Part Image 1 2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, Circuits, Tin (Sn) Plating, Embossed Tape Packaging Other 15-91-7060 1 Download Model
Part Image Part Image 1 Headers & Wire Housings 16 Ckt Vert. Header Other 55917-1610 1 Download Model
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59170-1-T-00-C LITTELFUSE
1 Magnetic/Reed Switches 59170-1-T-00-C SENS Other 59170-1-T-00-C 1 Download Model
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C559171 Yuandi
1 10P-1.27mm-SMD DIP Switches Other C559171 1 Download Model
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TLC5917IDR Texas Instruments
1 8-Bit Constant-Current LED Sink Driver Small Outline Packages TLC5917IDR 1 Download Model
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TLC5917IPW Texas Instruments
1 TLC5917IPW, LED Driver 8-Segments, 3.3, 5V, 16-Pin TSSOP Small Outline Packages TLC5917IPW 1 Download Model
Part Image Part Image 1 2.00mm Pitch MicroClasp Wire-to-Board Header, Dual Row, Vertical, 32 Circuits, without PCB Locator Other 55917-3230 1 Download Model
Part Image Part Image 1 Headers & Wire Housings 2.0 WTB DUAL CON DIP PLG HSG ASSY 14 CKT Header, Shrouded - Straight PTH Box 55917-1430 1 Download Model
Part Image Part Image 1 2.00mm Pitch MicroClasp Wire-to-Board Header, Dual Row, Vertical, 24 Circuits, without PCB Locator Other 55917-2430 1 Download Model
Part Image Part Image 1 Headers & Wire Housings 34 Ckt Vert. Header Other 55917-3410 1 Download Model
Part Image Part Image 1 Ideal Replacement for MELF Packages Mechanical Characteristics:; Case: Void-free, transfer-molded plastic; Finish: All external surfaces are corrosion resistant with readily solderable leads; Maximum Case Temperature for Soldering Purposes: 260 °C for 10 seconds; POLARITY: Cathode indicated by molded polarity notch or cathode band.; FLAMMABILITY RATING: UL94 V–0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Con Diodes Moulded 1SMA5917BT3G 1 Download Model
Part Image Part Image 1 MicroClasp Vertical Header, 2.00mm Pitch, Dual Row, Through Hole, Gold Flash (Au) Plating, 30 Circuits, without PCB Locator Other 0559173050 1 Download Model
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59177-1-U-00-D LITTELFUSE
1 The 59177 is an ultra-miniature overmolded reed switch 9.0mm x2.5mm x 2.4mm (0.354”x 0.098‘’x 0.094‘’) body with smallesttype footprint. It is capable of switching 170Vdc or 0.25A at up to10W. Available in select sensitivity ranges Other 59177-1-U-00-D 1 Download Model
Part Image Part Image 1 Zener Diodes - 1SMA5917-AU , AEC-Q101, 1500mW, 5V, 4.74.3, SMA Diodes Moulded 1SMA5917-AU 1 Download Model
Part Image Part Image 1 Molex MICROCLASP Series, Series Number 55917, 2mm Pitch 14 Way 2 Row Straight PCB Header, Solder Termination, 3A Other 55917-1410 1 Download Model
Part Image Part Image 1 2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, Circuits, Tin (Sn) Plating, Embossed Tape Packaging Other 15-91-7080 1 Download Model
Part Image Part Image 1 Headers & Wire Housings 16P VERT WTB HEADER DUAL ROW 2MM PITCH Other 55917-1630 1 Download Model
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59170-1-S-00-D LITTELFUSE
1 Magnetic / Reed Switches 59170-1-S-00-D SENSOR Other 59170-1-S-00-D 1 Download Model
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59170-1-S-00-A LITTELFUSE
1 Magnetic / Reed Switches 59170-1-S-00-A SENS Other 59170-1-S-00-A 1 Download Model
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1759172 Phoenix Contact
1 MSTB 2,5/18-G-5,08 - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 18, number of rows: 1, number of positions: 18, number of connections: 18, product range: MSTB 2,5/..-G, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.23 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector patter Other 1759172 1 Download Model
Part Image Part Image 1 MicroClasp Vertical Header, 2.00mm Pitch, Dual Row, Through Hole, Gold Flash (Au) Plating, 18 Circuits, without PCB Locator Other 0559171850 1 Download Model
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59177-1-T-00-D LITTELFUSE
1 The 59177 is an ultra-miniature overmolded reed switch 9.0mm x2.5mm x 2.4mm (0.354”x 0.098‘’x 0.094‘’) body with smallesttype footprint. It is capable of switching 170Vdc or 0.25A at up to10W. Available in select sensitivity ranges Other 59177-1-T-00-D 1 Download Model
Part Image Part Image 1 2.54mm Pitch SL Wire-to-Board Header, Low Profile, Surface Mount, Single Row, Right-Angle, 3.05mm Pocket, Shrouded, with Press-fit Plastic Peg, 9 Circuits, 0.75µm Gold (Au) Plating, Embossed Tape Packaging Other 0015917091 1 Download Model
Part Image Part Image 1 MicroClasp Vertical Header, 2.00mm Pitch, Dual Row, Through Hole, Gold Flash (Au) Plating, 34 Circuits, without PCB Locator Other 0559173450 1 Download Model
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1859179 Phoenix Contact
1 GICV 2,5/10-GF-7,62 - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 630 V, contact surface: Sn, contact connection type: Socket, number of potentials: 10, number of rows: 1, number of positions: 10, number of connections: 10, product range: GICV 2,5/..-GF, pitch: 7.62 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.6 mm, number of solder pins per potential: 2, plug-in system: COMBICON MSTB 2,5, Pin connector pa Other 1859179 1 Download Model
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