5083R Model Download Search Results
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Results for similar keyword: 50830
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50830
HELUKABEL
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1 | Wire And Cable, 1 Conductor(s), 00AWG, 1000V, Flexible Cord And Fixture Wire | 50830 |
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50830
Amphenol Communications Solutions
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1 | Board Connector, Receptacle | 50830 |
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50830
TE Connectivity
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1 | Body Features: Product Weight 4.536 G | Configuration Features: Number of Holes 1 | Contact Features: Terminal Orientation Straight | Terminal Plating Material Nickel | Barrel Type Closed | Dimensions: Stud Diameter 3.68 MM | Compatible Insulation Diameter (Max) .082 INCH | Compatible Insulation Diameter (Max) 2.08 MM | Wire Size 26 – 24 AWG | Tongue Thickness .5 MM | Wire Size .12 – .24 MMSQ | Stud Diameter .145 INCH | Product Length 18.8 MM | Compatible Insulation Diameter Range .032 – .082 INCH | T | 50830 |
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50830
TE's AMP
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1 | Ring Terminal, 0.24mm2 | 50830 |
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5083050
RS Pro
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1 | RS Pro 64 Way 2.54mm Pitch, Type B Class C1, 2 Row a/b, Right Angle DIN 41612 Connector, Plug, Solder | Other | 5083050 |
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55935-0830
Molex
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1 | Headers & Wire Housings 2.0 WtB Plg Hsg Assy Plg Hsg Assy RA 8Ckt | Other | 55935-0830 |
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350830-1
TE Connectivity
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1 | Configuration Features: Number of Positions 15 | PCB Mount Orientation Vertical | Number of Power Positions 15 | Number of Rows 3 | Contact Features: Contact Current Rating (Max) 19 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Layout Matrix | Contact Current Rating (Max) 12 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Mat | Other | 350830-1 |
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2-6450830-8
TE Connectivity
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1 | Configuration Features: Number of Signal Positions 20 | Number of Rows 4 | PCB Mount Orientation Right Angle | Number of Positions 24 | Number of Power Positions 4 | Contact Features: Contact Underplating Material Thickness 50 MICIN | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Underplating Material Thickness 2.87 MICM | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Type Blade | Contact Underplating Material Nickel | Contact Type Pin | Power Contact Bas | Other | 2-6450830-8 |
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TPS650830ZCGT
Texas Instruments
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1 | Power Management Specialised - PMIC Prog Wide Input Volt Pwr Mngt IC | BGA | TPS650830ZCGT |
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6450830-2
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Signal Positions 24 | Number of Positions 33 | Number of Power Positions 9 | Number of Rows 4 | Mating & Unmating Configuration Sequencing | Contact Features: Contact Type Pin | Contact Type Blade | Contact Retention Within Housing Without | Contact Current Rating (Max) 50 AMP | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Contact Termination Area Plating Material Tin | | Other | 6450830-2 |
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1 | Crystals 25.000MHZ 8pF 10ppm -20C +70C | Other | ECS-250-8-30B-CKM |
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2132250830
Molex
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1 | 1.50mm Pitch CLIK-Mate Wire-to-Board PCB Receptacle, Single Row, Surface Mount, Vertical, 0.38µm Gold (Au) Plating, 8 Circuits, Natural | Other | 2132250830 |
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213225-0830
Molex
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1 | CLIK-MATE1.5 SRVT SMT AU0.38 ETP 8P NAT | Other | 213225-0830 |
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TPS650830ZAJT
Texas Instruments
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1 | Programmable Mid-Input Voltage Range Power Management IC (PMIC) for Skylake Processors | BGA | TPS650830ZAJT |
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TPS650830ZAJR
Texas Instruments
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1 | Power Management Specialised - PMIC Program Wide Input V Powr Managt IC(PMIC) | BGA | TPS650830ZAJR |
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6450830-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Signal Positions 8 | Number of Positions 12 | Number of Power Positions 4 | Number of Rows 4 | Contact Features: Contact Mating Area Plating Material Thickness 3 MICIN | Contact Retention Within Housing Without | Contact Underplating Material Nickel | Contact Type Pin | Contact Type Blade | Power Contact Base Material Tin | Contact Current Rating (Max) 50 AMP | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Co | Other | 6450830-1 |
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5055750830
Molex
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1 | 2.00mm Pitch, Micro-Lock Plus PCB Header, Single Row, Vertical, Surface Mount, 0.38µm Gold Plating, Positive Lock, with Pick-and-Place Tape, 8 Circuits, Low-Halogen, Low-Halogen, Natural (White) | Other | 5055750830 |
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50830-5082E
Amphenol FCi
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1 | Board Connector, 246 Contact(s), 3 Row(s), Female, Right Angle, 0.1 inch Pitch, Solder Terminal, Guide Pin, Black Insulator, Receptacle | 50830-5082E |
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50830-3069F
Amphenol FCi
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1 | Board Connector, 207 Contact(s), 3 Row(s), Female, Right Angle, Solder Terminal, Receptacle | 50830-3069F |
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50830-148E
Amphenol FCi
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1 | Board Connector, 144 Contact(s), 3 Row(s), Female, Right Angle, Solder Terminal, Receptacle | 50830-148E |
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50830-569F
Amphenol FCi
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1 | Board Connector, 207 Contact(s), 3 Row(s), Female, Right Angle, Solder Terminal, Receptacle | 50830-569F |
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50830-1378E
Amphenol Communications Solutions
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1 | Board Connector, 378 Contact(s), 3 Row(s), Female, Right Angle, 0.1 inch Pitch, Solder Terminal, Guide Slot, Black Insulator, Plug | 50830-1378E |
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50830-193H
Amphenol Communications Solutions
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1 | Board Connector, 279 Contact(s), 3 Row(s), Female, Right Angle, Solder Terminal, Receptacle | 50830-193H |
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50830-5087F
Amphenol Communications Solutions
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1 | Board Connector, 261 Contact(s), 3 Row(s), Female, Right Angle, Solder Terminal, Receptacle | 50830-5087F |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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50830-5102F
Amphenol FCi
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1 | Board Connector, 306 Contact(s), 3 Row(s), Female, Right Angle, Solder Terminal, Receptacle | 50830-5102F |
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Build or Request | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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