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MC102522506JE
Ohmite
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1 | 250 MOhms ±5% 1.5W Chip Resistor 5025 J-Lead High Voltage, Non-Inductive Thick Film | Other | MC102522506JE |
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NK-2D2-015-225-TH00
Molex
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1 | Rectangular MIL Spec Connectors CONNECTOR, NANO | Other | NK-2D2-015-225-TH00 |
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MFR-25FTE52-255R
Yageo Group
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1 | 255 Ohms ±1% 0.25W, 1/4W Through Hole Resistor Axial Metal Film | Resistors, Axial Diameter Horizontal Mounting | MFR-25FTE52-255R |
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MSRLJ103SB5225MFNA01
TAIYO YUDEN
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1 | Multilayer Ceramic Capacitors MLCC - SMD/SMT 02046.3VDC 20% 2.2UF X5R AEC-Q200 | Capacitor Chip Non-polarised | MSRLJ103SB5225MFNA01 |
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PIC16F15225-I/ST
Microchip
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1 | IC MCU 8BIT 14KB FLASH 14TSSOP | Small Outline Packages | PIC16F15225-I/ST |
3
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BD5225G-2CGTR
ROHM Semiconductor
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1 | AEC-Q100 Qualified (Note1)◼ Nano Energy◼ Delay Time Setting controlled by external capacitor◼ Two output types (Nch open drain and CMOS output)◼ Very small, lightweight and thin package◼ Package SSOP5 is similar to SOT-23-5 (JEDEC)(Note1: Grade 1) | SOT23 (5-Pin) | BD5225G-2CGTR |
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MIC5225-5.0YM5-TR
Microchip
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1 | MICROCHIP - MIC5225-5.0YM5-TR - LDO VOLT REG, 0.15A, 5V, SOT-23-5 | SOT23 (5-Pin) | MIC5225-5.0YM5-TR |
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52255-0204D-001
Aces Electronic
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1 | Connector Header Surface Mount 20 position 0.039" (1.00mm) 30.0µin (0.76µm) 1A -40°C ~ 85°C | Other | 52255-0204D-001 |
3
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3522510RFT
TE Connectivity
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1 | Configuration Features: Number of Resistors 1 | Dimensions: Product Width 3.2 MM | Product Height .043 INCH | Product Length 6.35 MM | Product Width .126 INCH | Product Height 1.1 MM | Product Length .25 INCH | Electrical Characteristics: Power Rating 3 WATT | Resistance Class Up to 1kΩ | Passive Component Tolerance 1 PCT | Resistance Value 510 OHM | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Element Type Thick Film | Package Size Code 2512 | Resistor Type Power Resistor | | Resistor Chip | 3522510RFT |
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MMSZ5225BT1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA | Small Outline Diode | MMSZ5225BT1G |
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B32674Z5225K289
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 2.2uF, 520V DC, 15mm(W) x 24.5mm(H) x 31.5mm(L) | Other | B32674Z5225K289 |
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0395225003
Molex
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1 | 5.00mm Pitch Eurostyle Right-Angle PCB Header, Open Ends, Green Housing, 3 Circuits | Other | 0395225003 |
3
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B32674Z5225J003
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 2.2uF, 520V DC, 15mm(W) x 24.5mm(H) x 31.5mm(L) | Other | B32674Z5225J003 |
3
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MBASG21GBB5225KTNA01
TAIYO YUDEN
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1 | MULTILAYER CERAMIC CAPACITORS [Multilayer Ceramic Capacitors (High dielectric type) for Telecommunications Infrastructure and Industrial Equipment] | Other | MBASG21GBB5225KTNA01 |
3
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MBASU31LSB5225MTNA01
TAIYO YUDEN
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1 | MULTILAYER CERAMIC CAPACITORS [Multilayer Ceramic Capacitors (High dielectric type) for Telecommunications Infrastructure and Industrial Equipment] | Other | MBASU31LSB5225MTNA01 |
3
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MBASU31LSB5225KTNA01
TAIYO YUDEN
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1 | MULTILAYER CERAMIC CAPACITORS [Multilayer Ceramic Capacitors (High dielectric type) for Telecommunications Infrastructure and Industrial Equipment] | Other | MBASU31LSB5225KTNA01 |
3
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MMBZ5225BLT1G
onsemi
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1 | 225 mW Rating on FR-4 or FR-5 Board; Zener Voltage Range - 2.4 V to 91 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model Mechanical Characteristics; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMABILITY RATING: | SOT23 (3-Pin) | MMBZ5225BLT1G |
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2395225-2
TE Connectivity
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1 | PCB Mount Header, Vertical, Wire-to-Board, 20 Position, 2.5 mm [.098 in] Centerline, Fully Shrouded, Tin (Sn), Through Hole - Solder, FLIP-N-LOK | Other | 2395225-2 |
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SZMMSZ5225BT1G
onsemi
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1 | 500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA | Small Outline Diode | SZMMSZ5225BT1G |
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MBASE219JB5225MTNA01
TAIYO YUDEN
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1 | MULTILAYER CERAMIC CAPACITORS [Multilayer Ceramic Capacitors (High dielectric type) for Telecommunications Infrastructure and Industrial Equipment] | Other | MBASE219JB5225MTNA01 |
3
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B32673P5225K289
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 2.2uF, 520V DC, 10.5mm(W) x 20.5mm(H) x 26.5mm(L) | Other | B32673P5225K289 |
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MMSZ5225B-7-F
Diodes Incorporated
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1 | Zener Diodes 3V 500mW | Small Outline Diode | MMSZ5225B-7-F |
3
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SER1052-252MLC
COILCRAFT
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1 | Power inductor, high current, 20% tol, SMT, RoHS | Other | SER1052-252MLC |
3
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MFR-25FBF52-255R
Yageo Group
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1 | 255 Ohms ±1% 0.25W, 1/4W Through Hole Resistor Axial Metal Film | Resistors, Axial Diameter Horizontal Mounting | MFR-25FBF52-255R |
3
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TPS75225QPWPR
Texas Instruments
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1 | 2-A Low-Dropout Voltage Regulators with Power Good | Small Outline Packages | TPS75225QPWPR |
3
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