55557 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	5555799-1 TE Connectivity	1	Body Features: Connector Profile Standard \| Modular Jack Latch Orientation Standard - Latch Down \| Configuration Features: Number of Positions 8 \| Port Configuration Single Port \| Status Light Type Not Illuminated \| Connector Contact Density Standard \| Port Matrix Configuration 1 x 1 \| PCB Mount Orientation Vertical \| Number of Loaded Positions 8 \| Contact Features: Contact Mating Area Plating Material Thickness 1.27 MICM \| Contact Base Material Phosphor Bronze \| Contact Mating Area Plating Material Gold \|	Other	5555799-1	3D model available Symbol and footprint available 3	1 Download Model
	5555764-1 TE Connectivity	1	Body Features: Connector Profile Low \| Modular Jack Latch Orientation Standard - Latch Down \| Configuration Features: Connector Contact Density Standard \| Port Matrix Configuration 1 x 1 \| PCB Mount Orientation Right Angle \| Port Configuration Single Port \| Status Light Type Not Illuminated \| Number of Positions 8 \| Number of Loaded Positions 8 \| Contact Features: Contact Current Rating (Max) 1.5 AMP \| Contact Mating Area Plating Material Thickness 50 MICIN \| Contact Base Material Phosphor Bronze \| Contact	Other	5555764-1	3D model available Symbol and footprint available 3	1 Download Model
	5555799-1 TE Connectivity	1	Body Features: Connector Profile Standard \| Modular Jack Latch Orientation Standard - Latch Down \| Configuration Features: Number of Positions 8 \| Port Configuration Single Port \| Status Light Type Not Illuminated \| Connector Contact Density Standard \| Port Matrix Configuration 1 x 1 \| PCB Mount Orientation Vertical \| Number of Loaded Positions 8 \| Contact Features: Contact Mating Area Plating Material Thickness 1.27 MICM \| Contact Base Material Phosphor Bronze \| Contact Mating Area Plating Material Gold \|	Other	5555799-1	3D model available Symbol and footprint available 3	1 Download Model
	5555764-1 TE Connectivity	1	Body Features: Connector Profile Low \| Modular Jack Latch Orientation Standard - Latch Down \| Configuration Features: Connector Contact Density Standard \| Port Matrix Configuration 1 x 1 \| PCB Mount Orientation Right Angle \| Port Configuration Single Port \| Status Light Type Not Illuminated \| Number of Positions 8 \| Number of Loaded Positions 8 \| Contact Features: Contact Current Rating (Max) 1.5 AMP \| Contact Mating Area Plating Material Thickness 50 MICIN \| Contact Base Material Phosphor Bronze \| Contact	Other	5555764-1	3D model available Symbol and footprint available 3	1 Download Model

	5055557-4 TE Connectivity	1	Body Features: Terminal Profile High \| Configuration Features: Number of Positions 10 \| PCB Mount Orientation Vertical \| Contact Features: PCB Contact Termination Area Plating Material Finish Matte \| Contact Mating Area Plating Material Finish Matte \| Contact Mating Area Plating Material Thickness 3.81 MICM \| PCB Contact Termination Area Plating Material Tin \| Contact Fabrication Stamped & Formed \| Contact Mating Area Plating Material Thickness 150 MICIN \| Contact Mating Area Plating Material Tin \| PCB Cont	Other	5055557-4	3D model available Symbol and footprint available 3	1 Download Model
	55557-3 TE's AMP	1	INTERCONNECTION DEVICE		55557-3	3D model not available Symbol and footprint not available 0	0 Build or Request
	55557-5 TE Connectivity	1	Interconnect Device:Other, INTERCONNECTION DEVICE, INTERCONNECTION DEVICE		55557-5	3D model not available Symbol and footprint not available 0	0 Build or Request
	55557-2 TE's AMP	1	INTERCONNECTION DEVICE		55557-2	3D model not available Symbol and footprint not available 0	0 Build or Request
	55557-5 TE's AMP	1	INTERCONNECTION DEVICE		55557-5	3D model not available Symbol and footprint not available 0	0 Build or Request
	55557-3 TE Connectivity	1	Interconnect Device:Other, INTERCONNECTION DEVICE, INTERCONNECTION DEVICE		55557-3	3D model not available Symbol and footprint not available 0	0 Build or Request
	5555764-3 TE Connectivity	1	Body Features: Connector Profile Low \| Modular Jack Latch Orientation Standard - Latch Down \| Configuration Features: Status Light Type Not Illuminated \| Port Configuration Single Port \| Port Matrix Configuration 1 x 1 \| Number of Positions 8 \| PCB Mount Orientation Right Angle \| Number of Loaded Positions 8 \| Connector Contact Density Standard \| Contact Features: Contact Mating Area Plating Material Thickness 1.27 MICM \| Contact Mating Area Plating Material Thickness 50 MICIN \| Contact Underplating Materia		5555764-3	3D model available Symbol and footprint not available 1	1 Download Model
	55557-2 TE Connectivity	1	Interconnect Device:Other, INTERCONNECTION DEVICE, INTERCONNECTION DEVICE		55557-2	3D model not available Symbol and footprint not available 0	0 Build or Request
	55557-4 TE Connectivity	1	POWER TAP 10P HIGH PROFILE, LEAD-TIN		55557-4	3D model not available Symbol and footprint not available 0	0 Build or Request
	55557-1 TE's AMP	1	INTERCONNECTION DEVICE		55557-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	55557-1 TE Connectivity	1	Interconnect Device:Other, INTERCONNECTION DEVICE, INTERCONNECTION DEVICE		55557-1	3D model not available Symbol and footprint not available 0	0 Build or Request

	1355557-1 TE Connectivity	1	CONNECTOR ACCESSORY		1355557-1	3D model not available Symbol and footprint not available 0	0 Build or Request
	555-5704F Dialight	1	Single Color LED, Yellow, Water Clear Nondiffused, T-1 3/4, 5mm, ROHS COMPLIANT PACKAGE-2		555-5704F	3D model not available Symbol and footprint not available 0	0 Build or Request
	935310355557 NXP Semiconductors	1	Microprocessor		935310355557	3D model not available Symbol and footprint not available 0	0 Build or Request
	305-046-555-578 EDAC Inc	1	Headers and Edge Type Connector,		305-046-555-578	3D model not available Symbol and footprint not available 0	0 Build or Request
	355-016-555-578 EDAC Inc	1	Headers and Edge Type Connector,		355-016-555-578	3D model not available Symbol and footprint not available 0	0 Build or Request
	315-076-555-578 EDAC Inc	1	Headers and Edge Type Connector,		315-076-555-578	3D model not available Symbol and footprint not available 0	0 Build or Request
	305-042-555-578 EDAC Inc	1	Headers and Edge Type Connector,		305-042-555-578	3D model not available Symbol and footprint not available 0	0 Build or Request
	345-110-555-578 EDAC Inc	1	Card Edge Connector, 110 Contact(s), 2 Row(s), Female, Right Angle, 0.1 inch Pitch, Surface Mount Terminal, Guide Set, Green Insulator,		345-110-555-578	3D model not available Symbol and footprint not available 0	0 Build or Request
	935323155557 NXP Semiconductors	1	RISC Microcontroller		935323155557	3D model not available Symbol and footprint not available 0	0 Build or Request
	395-102-555-578 EDAC Inc	1	Card Edge Connector, 102 Contact(s), 2 Row(s), Female, Right Angle, 0.1 inch Pitch, Surface Mount Terminal, Guide Set, Black Insulator,		395-102-555-578	3D model not available Symbol and footprint not available 0	0 Build or Request
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