60033 Model Download Search Results
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60033
Vanguard Electronics Company
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1 | General Purpose Inductor, 1875uH, 10%, 2 Element, SMD, 2626 | 60033 |
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60033
HELUKABEL
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1 | Wire And Cable, 60 Conductor(s), 16AWG, Flexible Cord And Fixture Wire | 60033 |
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6600333-6
TE Connectivity
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1 | Configuration Features: Number of Signal Positions 24 | Number of Power Positions 8 | Number of Rows 4 | PCB Mount Orientation Vertical | Number of Positions 32 | Contact Features: Contact Mating Area Plating Material Gold | Power Contact Base Material Tin | Contact Underplating Material Nickel | Contact Underplating Material Thickness 5.97 MICM | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Mating Area Plating Material Thickness .076 MICM | Contact Type Pin | PCB Contact Termination Are | Other | 6600333-6 |
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744383560033HT
Würth Elektronik
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1 | WE-MAPI SMT Power Inductor Size 4020; L = 0.33 µH ±30%; IR = 13.3 A; Isat = 14.8 A; RDC = 7.5 mΩ | Inductors Precision Moulded | 744383560033HT |
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7447860033G
Würth Elektronik
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1 | WE-MK Multilayer Ceramic SMT Inductor Size 0603; L = 3,3 nH ± 0.1nH; Q min = 10; RDCmax = 0,12 Ω | Inductors Chip | 7447860033G |
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744373460033
Würth Elektronik
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1 | WE-LHMI SMT Power Inductor Size 7030; L = 0.33 µH ; IR = 13.0 A; Isat = 47 A; RDC = 3.9 mΩ | Other | 744373460033 |
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2106003-3
TE Connectivity
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1 | Connector pcb smt IDC 3 way 18AWG SSL | Other | 2106003-3 |
3
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MCSJK-3N-16.00-3.3-50-B
Multicomp Pro
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1 | MULTICOMP PRO - MCSJK-3N-16.00-3.3-50-B - Oscillator, 16 MHz, 50 ppm, SMD, 3.2mm x 2.5mm, CMOS, 3.3 V, -20°C to +70°C | Other | MCSJK-3N-16.00-3.3-50-B |
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784383560033
Würth Elektronik
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1 | WE-MAIA SMT Power Inductor Size 4020; L = 0.33 µH ±30%; IRP = 14.95 A; Isat = 16.7 A; RDC = 7.2 mΩ | Other | 784383560033 |
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744760033A
Würth Elektronik
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1 | WE-KI SMT Wire Wound Ceramic Inductor Size 0805; L = 3.3 nH ±0.2 nH; Qmin = 60; RDCmax = 0.08 Ω | Other | 744760033A |
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744373360033
Würth Elektronik
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1 | WE-LHMI SMT Power Inductor Size 5030; L = 0.33 µH ; IR = 10.6 A; Isat = 29,3 A; RDC = 5.0 mΩ | Inductors Precision Moulded | 744373360033 |
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6600333-9
TE Connectivity
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1 | Configuration Features: Number of Rows 4 | Mating & Unmating Configuration Sequencing | PCB Mount Orientation Vertical | Number of Signal Positions 16 | Number of Positions 18 | Number of Power Positions 2 | Contact Features: Contact Underplating Material Thickness 5.97 MICM | PCB Contact Termination Area Plating Material Tin | Power Contact Base Material Tin | Contact Underplating Material Nickel | Contact Type Pin | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Current Rating (Max) 42 A | Other | 6600333-9 |
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MCSJK-3N-16.00-3.3-25-B
Multicomp Pro
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1 | MULTICOMP - MCSJK-3N-16.00-3.3-25-B - OSCILLATOR, 16MHZ, 3.2MM X 2.5MM, CMOS | Other | MCSJK-3N-16.00-3.3-25-B |
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621-009-260-033
EDAC
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1 | CONN D-SUB PLUG 9POS R/A SOLDER | Other | 621-009-260-033 |
2
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086260033340829+
Kyocera AVX
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1 | FFC & FPC Connectors | Other | 086260033340829+ |
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UE86G16360033T
Amphenol Communications Solutions
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1 | XCede I/O, High Speed Input Output Connectors, 1X1 XCede IO COMBO. | Other | UE86G16360033T |
2
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ABM10-16.003333MHZ-8-1-A10-T
ABRACON
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1 | CERAMIC SMD ULTRA MINIATURE QUARTZ CRYSTAL | Other | ABM10-16.003333MHZ-8-1-A10-T |
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AXK600337YG
Panasonic
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1 | 100 Position Connector Header, Outer Shroud Contacts Surface Mount Gold , 60V , 500mA | Other | AXK600337YG |
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744383560033
Würth Elektronik
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1 | 330 nH Shielded Molded Inductor 9.6 A 7.2mOhm Max 1616 (4040 Metric) , 115 MHz , 7.2mOhm Max , -40 °C ~ +125 °C | Other | 744383560033 |
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744373560033
Würth Elektronik
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1 | WE-LHMI SMT Power Inductor Size 8030; L = 0.33 µH ; IR = 16 A; Isat = 51,9 A; RDC = 2.57 mΩ | Inductors Precision Moulded | 744373560033 |
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746600330R
Würth Elektronik
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1 | WP-SMBU REDCUBE Bush, SMT_open height: 3mm, total height: 4mm, thread: M3 x 4mm, diameter: 7mm, on Reel, with Polyimide Tape, REDCUBE SMT; M3, thr 4mm | Other | 746600330R |
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6600330-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 2 | Number of Signal Positions 24 | Mating & Unmating Configuration Sequencing | Number of Rows 4 | Number of Positions 26 | Contact Features: Contact Mating Area Plating Material Thickness .076 MICM | Contact Underplating Material Thickness 5.97 MICM | Contact Underplating Material Nickel | Contact Type Pin | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Power Contact Base Material Tin | Contact Mat | Other | 6600330-4 |
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744383360033
Würth Elektronik
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1 | WE-MAPI SMT Power Inductor Size 3020; L = 0.33 µH ±30%; IR = 8.7 A; Isat = 10.5 A; RDCmax = 17 mΩ | Inductors Precision Moulded | 744383360033 |
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6600330-6
TE Connectivity
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1 | Rectangular Power Connectors, Header, Plug, Board-to-Board, 28 Position, 2P+24S+2P, 6.35 mm / 2.54 mm [.25 in / .1 in] Centerline, Printed Circuit Board | Other | 6600330-6 |
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1-6600333-0
TE Connectivity
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1 | PCB Mount Header, Vertical, Board-to-Board, 20 Position, 2.54 mm / 6.35 mm [.1 in / .25 in] Centerline, Fully Shrouded, Gold, Through Hole - Press-Fit | Other | 1-6600333-0 |
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