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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MG643432
KET
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1 | Pre-ordered Connectors ROHS SMT Assembly PCB Connector 82.3*23.5*19.0 pin 48 DIP-VRT | Other | MG643432 |
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643428-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 12 | Number of Rows 3 | Number of Power Positions 12 | Number of Signal Positions 0 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Tin | Contact Type Socket | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Pre-Tin | Cont | Other | 643428-1 |
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ECWF6434RHL
Panasonic
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1 | Metallized PP Film Capacitor MPP, 0.43μF ±3%, 630V, -40 to 105 (85)°C, (20.5Lx13.00Wx24.5H) | Other | ECWF6434RHL |
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ECWF6434RJL
Panasonic
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1 | Cap Film 0.43uF 630V PP 5% (20.5 X 13 X 24.5mm) Radial 7.5mm 105°C Ammo Pack | Other | ECWF6434RJL |
3
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1643410000
Weidmüller
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1 | PCB connector (board connection), 160 V, 15 A, Pitch in mm: 3.50, Number of poles: 10, THT solder connection, Box | Other | 1643410000 |
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SL21THR16434Z
Fischer Elektronik GmbH & Co. KG
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1 | male header | Other | SL21THR16434Z |
3
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SL2216434S
Fischer Elektronik GmbH & Co. KG
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1 | male header | Header, Vertical | SL2216434S |
3
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ECWF6434HLB
Panasonic
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1 | Metallized Polypropylene Film Capacitor MPP 630v, -40 to 105°C, 0.43µF, 3% (20.5x13x24.5mm) | Other | ECWF6434HLB |
3
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SL2216434Z
Fischer Elektronik GmbH & Co. KG
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1 | male header | Header, Vertical | SL2216434Z |
3
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ECW-F6434JLB
Panasonic
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1 | Metallized Polypropylene Film Capacitor,0.43uF,630V,20.5x13.0x24.5 | Other | ECW-F6434JLB |
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1864340000
Weidmüller
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1 | PCB connector (board connection), 160 V, 17.5 A, Pitch in mm: 3.81, Number of poles: 9, THT/THR solder connection, Tape | Other | 1864340000 |
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643413-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 3 | Number of Rows 1 | Number of Power Positions 3 | Contact Features: Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Pre-Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 12 AMP | Contact Layout Inline | Multiple Contact Types Without | Contact Type Socket | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Matin | Other | 643413-1 |
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SL2216434G
Fischer Elektronik GmbH & Co. KG
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1 | male header | Header, Vertical | SL2216434G |
3
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1864341
Phoenix Contact
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1 | SPTAF 1/ 8-3,5-LL - Printed circuit board terminal, nominal current: 13.5 A, rated voltage (III/2): 160 V, nominal cross section: 1 mm2, number of potentials: 8, number of rows: 1, number of positions per row: 8, product range: SPTAF 1/..-LL, pitch: 3.5 mm, connection method: Push-in spring connection, mounting: Wave soldering, conductor/PCB connection direction: 45 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 2.6 mm, number of solder pins per potential: 2, type of packaging: pack | Other | 1864341 |
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SLLP116434S
Fischer Elektronik GmbH & Co. KG
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1 | Low Profile Straight Male PCB Connector, THT, 34 Position, 250 V AC, 2000V | Other | SLLP116434S |
3
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643425-1
TE Connectivity
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1 | Configuration Features: Number of Positions 9 | PCB Mount Orientation Vertical | Number of Rows 3 | Number of Power Positions 9 | Contact Features: PCB Contact Termination Area Plating Material Pre-Tin | Contact Current Rating (Max) 12 AMP | Contact Layout Matrix | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Type Socket | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Matin | Other | 643425-1 |
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643408-1
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Rows 1 | Number of Positions 6 | PCB Mount Orientation Vertical | Contact Features: PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Tin | Contact Layout Inline | Contact Type Pin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Multiple Contact Types Without | Contact Retentio | Other | 643408-1 |
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643414-1
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 3 | Contact Features: Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Current Rating (Max) 12 AMP | Contact Type Socket | Contact Layout Inline | PCB Contact Termination Area Plating Material Pre-Tin | Contact Retention Within Housing Without | Mul | Other | 643414-1 |
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SL20THR16434GECO
Fischer Elektronik GmbH & Co. KG
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1 | male header | Other | SL20THR16434GECO |
3
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ECW-F6434RJL
Panasonic
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1 | 0.43 µF Film Capacitor 630V Polypropylene (PP), Metallized Radial L Dimension (mm) t20.5 T Dimension (mm) t13.00 H Dimension (mm) t24.5 | Other | ECW-F6434RJL |
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ECW-F6434JL
Panasonic
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1 | Metallized Polypropylene Film Capacitor MPP, 0.43μF ±5%, 630V, -40 to 105 (85)°C, (20.5Lx13.00Wx19.5H) | Other | ECW-F6434JL |
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SLLP216434G
Fischer Elektronik GmbH & Co. KG
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1 | Dual Row, Low Profile, Straight, Male PCB Connector, THT, 34 Position, 250 V AC, 2000V | Other | SLLP216434G |
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SLLP116434Z
Fischer Elektronik GmbH & Co. KG
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1 | Low Profile Straight Male PCB Connector, THT, 34 Position, 250 V AC, 2000V | Other | SLLP116434Z |
3
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643414-3
TE Connectivity
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1 | Configuration Features: Number of Positions 3 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 3 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Layout Inline | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Type Socket | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 | Other | 643414-3 |
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643412-1
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 2 | Number of Rows 1 | Number of Positions 2 | Contact Features: PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Multiple Contact Types Without | Contact Layout Inline | Contact Current Rating (Max) 1 | Other | 643412-1 |
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