66003 Footprint, Symbol and 3D Model search results

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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	6600330-6 TE Connectivity	1	Rectangular Power Connectors, Header, Plug, Board-to-Board, 28 Position, 2P+24S+2P, 6.35 mm / 2.54 mm [.25 in / .1 in] Centerline, Printed Circuit Board	Other	6600330-6	3D model available Symbol and footprint available 3	1 Download Model
	6600333-9 TE Connectivity	1	Configuration Features: Number of Rows 4 \| Mating & Unmating Configuration Sequencing \| PCB Mount Orientation Vertical \| Number of Signal Positions 16 \| Number of Positions 18 \| Number of Power Positions 2 \| Contact Features: Contact Underplating Material Thickness 5.97 MICM \| PCB Contact Termination Area Plating Material Tin \| Power Contact Base Material Tin \| Contact Underplating Material Nickel \| Contact Type Pin \| Contact Mating Area Plating Material Thickness 3 MICIN \| Contact Current Rating (Max) 42 A	Other	6600333-9	3D model available Symbol and footprint available 3	1 Download Model
	6600333-6 TE Connectivity	1	Configuration Features: Number of Signal Positions 24 \| Number of Power Positions 8 \| Number of Rows 4 \| PCB Mount Orientation Vertical \| Number of Positions 32 \| Contact Features: Contact Mating Area Plating Material Gold \| Power Contact Base Material Tin \| Contact Underplating Material Nickel \| Contact Underplating Material Thickness 5.97 MICM \| Contact Mating Area Plating Material Thickness 3 MICIN \| Contact Mating Area Plating Material Thickness .076 MICM \| Contact Type Pin \| PCB Contact Termination Are	Other	6600333-6	3D model available Symbol and footprint available 3	1 Download Model
	6600333-6 TE Connectivity	1	Configuration Features: Number of Signal Positions 24 \| Number of Power Positions 8 \| Number of Rows 4 \| PCB Mount Orientation Vertical \| Number of Positions 32 \| Contact Features: Contact Mating Area Plating Material Gold \| Power Contact Base Material Tin \| Contact Underplating Material Nickel \| Contact Underplating Material Thickness 5.97 MICM \| Contact Mating Area Plating Material Thickness 3 MICIN \| Contact Mating Area Plating Material Thickness .076 MICM \| Contact Type Pin \| PCB Contact Termination Are	Other	6600333-6	3D model available Symbol and footprint available 3	1 Download Model

	6600333-9 TE Connectivity	1	Configuration Features: Number of Rows 4 \| Mating & Unmating Configuration Sequencing \| PCB Mount Orientation Vertical \| Number of Signal Positions 16 \| Number of Positions 18 \| Number of Power Positions 2 \| Contact Features: Contact Underplating Material Thickness 5.97 MICM \| PCB Contact Termination Area Plating Material Tin \| Power Contact Base Material Tin \| Contact Underplating Material Nickel \| Contact Type Pin \| Contact Mating Area Plating Material Thickness 3 MICIN \| Contact Current Rating (Max) 42 A	Other	6600333-9	3D model available Symbol and footprint available 3	1 Download Model
	6600330-4 TE Connectivity	1	Configuration Features: PCB Mount Orientation Vertical \| Number of Power Positions 2 \| Number of Signal Positions 24 \| Mating & Unmating Configuration Sequencing \| Number of Rows 4 \| Number of Positions 26 \| Contact Features: Contact Mating Area Plating Material Thickness .076 MICM \| Contact Underplating Material Thickness 5.97 MICM \| Contact Underplating Material Nickel \| Contact Type Pin \| Contact Mating Area Plating Material Gold Flash over Palladium Nickel \| Power Contact Base Material Tin \| Contact Mat	Other	6600330-4	3D model available Symbol and footprint available 3	1 Download Model
	6600330-4 TE Connectivity	1	Configuration Features: PCB Mount Orientation Vertical \| Number of Power Positions 2 \| Number of Signal Positions 24 \| Mating & Unmating Configuration Sequencing \| Number of Rows 4 \| Number of Positions 26 \| Contact Features: Contact Mating Area Plating Material Thickness .076 MICM \| Contact Underplating Material Thickness 5.97 MICM \| Contact Underplating Material Nickel \| Contact Type Pin \| Contact Mating Area Plating Material Gold Flash over Palladium Nickel \| Power Contact Base Material Tin \| Contact Mat	Other	6600330-4	3D model available Symbol and footprint available 3	1 Download Model
	6600330-6 TE Connectivity	1	Rectangular Power Connectors, Header, Plug, Board-to-Board, 28 Position, 2P+24S+2P, 6.35 mm / 2.54 mm [.25 in / .1 in] Centerline, Printed Circuit Board	Other	6600330-6	3D model available Symbol and footprint available 3	1 Download Model
	66003 HELUKABEL	1	Wire And Cable, 1 Conductor(s), 26AWG, 300V, Flexible Cord And Fixture Wire,		66003	3D model not available Symbol and footprint not available 0	0 Build or Request
	ADF6-60-03.5-L-4-2-A-TR SAMTEC	1	240 Position Connector High Density Array, Female Surface Mount Gold	Other	ADF6-60-03.5-L-4-2-A-TR	3D model available Symbol and footprint available 3	1 Download Model
	EM366003 Eaton	1	Fixed Terminal Blocks	Header, Receptacle - Straight PTH Box	EM366003	3D model available Symbol and footprint available 3	1 Download Model
	0466003.NR LITTELFUSE	1	Littelfuse 3A FF Surface Mount Fuse, 32 V ac/dc	Fuses Chip	0466003.NR	3D model available Symbol and footprint available 3	1 Download Model
	N2516-6003-RB 3M	1	Conn Shrouded Header HDR 16 POS 2.54mm Solder ST Thru-Hole	Header, Shrouded - Straight PTH Box	N2516-6003-RB	3D model available Symbol and footprint available 3	1 Download Model
	ADM6-60-03.5-L-4-2-TR SAMTEC	1	Board to Board & Mezzanine Connectors 0.635 mm AcceleRate HD High-Density 4-Row Terminal	Other	ADM6-60-03.5-L-4-2-TR	3D model available Symbol and footprint available 3	1 Download Model
	7440660035 Würth Elektronik	1	Wurth WE-TPC Series Shielded Wire-wound SMD Inductor with a Ferrite Core, 3.5 μH ±30% 6.4A Idc	Other	7440660035	3D model available Symbol and footprint available 3	1 Download Model

	0466003.NRHF LITTELFUSE	1	Surface Mount Fuses 32V 3A FA HALIDE FREE SLIM	Fuses Chip	0466003.NRHF	3D model available Symbol and footprint available 3	1 Download Model
	746600330R Würth Elektronik	1	Wurth Elektronik WP-SMBU PCB Screw Terminal, 50A, Through Hole, M3	Other	746600330R	3D model available Symbol and footprint available 3	1 Download Model
	0466003. LITTELFUSE	1	Surface Mount Fuses 32V 3A FA HALIDE FREE SLIM	Fuses Chip	0466003.	3D model available Symbol and footprint available 3	1 Download Model
	N2526-6003RB 3M	1	3M 2500, 2.54mm Pitch, 26 Way, 2 Row, Straight PCB Header, Through Hole	Header, Shrouded - Straight PTH Box	N2526-6003RB	3D model available Symbol and footprint available 3	1 Download Model
	N2516-6003RB 3M	1	3M, 2500, 16 Way, 2 Row, Straight PCB Header	Header, Shrouded - Straight PTH Box	N2516-6003RB	3D model available Symbol and footprint available 3	1 Download Model
	ADF6–60–03.5–L–4–2–A SAMTEC	1	HIGH-DENSITY SLIM BODY ARRAYS (0.635 mm) .025" PITCH	Other	ADF6–60–03.5–L–4–2–A	3D model available Symbol and footprint available 3	1 Download Model
	7466003R Würth Elektronik	1	Wurth Elektronik, Screw Terminal, Vertical, 50A	Other	7466003R	3D model available Symbol and footprint available 3	1 Download Model
	73366-0030 Molex	1	Molex 73366Series, Right Angle Through Hole MCX Connector jack, 50Ω Impedance, 6GHz	Other	73366-0030	3D model available Symbol and footprint available 3	1 Download Model
	6600393-4 TE Connectivity	1	Configuration Features: Number of Positions 8 \| PCB Mount Orientation Vertical \| Number of Rows 1 \| Number of Signal Positions 0 \| Number of Power Positions 8 \| Contact Features: Contact Mating Area Plating Material Thickness .076 MICM \| Contact Underplating Material Nickel \| Contact Mating Area Plating Material Gold Flash over Palladium Nickel \| Contact Current Rating (Max) 42 AMP \| Contact Type Blade \| PCB Contact Termination Area Plating Material Tin \| Power Contact Base Material Tin \| Contact Base Mater		6600393-4	3D model available Symbol and footprint not available 1	1 Download Model
	6600310-8 TE Connectivity	1	Configuration Features: Number of Power Positions 9 \| PCB Mount Orientation Vertical \| Number of Positions 33 \| Number of Signal Positions 24 \| Mating & Unmating Configuration Sequencing \| Contact Features: Contact Mating Area Plating Material Thickness 3 MICIN \| Contact Mating Area Plating Material Gold Flash over Palladium Nickel \| Contact Retention Within Housing Without \| Contact Current Rating (Max) 42 AMP \| Power Contact Base Material Tin \| Contact Underplating Material Thickness 5.97 MICM \| Contact U		6600310-8	3D model available Symbol and footprint not available 1	1 Download Model
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