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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action |
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Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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6600330-6
TE Connectivity
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1 | Rectangular Power Connectors, Header, Plug, Board-to-Board, 28 Position, 2P+24S+2P, 6.35 mm / 2.54 mm [.25 in / .1 in] Centerline, Printed Circuit Board | Other | 6600330-6 |
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6600333-9
TE Connectivity
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1 | Configuration Features: Number of Rows 4 | Mating & Unmating Configuration Sequencing | PCB Mount Orientation Vertical | Number of Signal Positions 16 | Number of Positions 18 | Number of Power Positions 2 | Contact Features: Contact Underplating Material Thickness 5.97 MICM | PCB Contact Termination Area Plating Material Tin | Power Contact Base Material Tin | Contact Underplating Material Nickel | Contact Type Pin | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Current Rating (Max) 42 A | Other | 6600333-9 |
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6600333-6
TE Connectivity
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1 | Configuration Features: Number of Signal Positions 24 | Number of Power Positions 8 | Number of Rows 4 | PCB Mount Orientation Vertical | Number of Positions 32 | Contact Features: Contact Mating Area Plating Material Gold | Power Contact Base Material Tin | Contact Underplating Material Nickel | Contact Underplating Material Thickness 5.97 MICM | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Mating Area Plating Material Thickness .076 MICM | Contact Type Pin | PCB Contact Termination Are | Other | 6600333-6 |
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6600333-6
TE Connectivity
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1 | Configuration Features: Number of Signal Positions 24 | Number of Power Positions 8 | Number of Rows 4 | PCB Mount Orientation Vertical | Number of Positions 32 | Contact Features: Contact Mating Area Plating Material Gold | Power Contact Base Material Tin | Contact Underplating Material Nickel | Contact Underplating Material Thickness 5.97 MICM | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Mating Area Plating Material Thickness .076 MICM | Contact Type Pin | PCB Contact Termination Are | Other | 6600333-6 |
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6600333-9
TE Connectivity
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1 | Configuration Features: Number of Rows 4 | Mating & Unmating Configuration Sequencing | PCB Mount Orientation Vertical | Number of Signal Positions 16 | Number of Positions 18 | Number of Power Positions 2 | Contact Features: Contact Underplating Material Thickness 5.97 MICM | PCB Contact Termination Area Plating Material Tin | Power Contact Base Material Tin | Contact Underplating Material Nickel | Contact Type Pin | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Current Rating (Max) 42 A | Other | 6600333-9 |
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6600330-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 2 | Number of Signal Positions 24 | Mating & Unmating Configuration Sequencing | Number of Rows 4 | Number of Positions 26 | Contact Features: Contact Mating Area Plating Material Thickness .076 MICM | Contact Underplating Material Thickness 5.97 MICM | Contact Underplating Material Nickel | Contact Type Pin | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Power Contact Base Material Tin | Contact Mat | Other | 6600330-4 |
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6600330-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 2 | Number of Signal Positions 24 | Mating & Unmating Configuration Sequencing | Number of Rows 4 | Number of Positions 26 | Contact Features: Contact Mating Area Plating Material Thickness .076 MICM | Contact Underplating Material Thickness 5.97 MICM | Contact Underplating Material Nickel | Contact Type Pin | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Power Contact Base Material Tin | Contact Mat | Other | 6600330-4 |
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6600330-6
TE Connectivity
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1 | Rectangular Power Connectors, Header, Plug, Board-to-Board, 28 Position, 2P+24S+2P, 6.35 mm / 2.54 mm [.25 in / .1 in] Centerline, Printed Circuit Board | Other | 6600330-6 |
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66003
HELUKABEL
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1 | Wire And Cable, 1 Conductor(s), 26AWG, 300V, Flexible Cord And Fixture Wire, | 66003 |
0
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ADF6-60-03.5-L-4-2-A-TR
SAMTEC
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1 | 240 Position Connector High Density Array, Female Surface Mount Gold | Other | ADF6-60-03.5-L-4-2-A-TR |
3
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EM366003
Eaton
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1 | Fixed Terminal Blocks | Header, Receptacle - Straight PTH Box | EM366003 |
3
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0466003.NR
LITTELFUSE
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1 | Littelfuse 3A FF Surface Mount Fuse, 32 V ac/dc | Fuses Chip | 0466003.NR |
3
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1 | Conn Shrouded Header HDR 16 POS 2.54mm Solder ST Thru-Hole | Header, Shrouded - Straight PTH Box | N2516-6003-RB |
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ADM6-60-03.5-L-4-2-TR
SAMTEC
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1 | Board to Board & Mezzanine Connectors 0.635 mm AcceleRate HD High-Density 4-Row Terminal | Other | ADM6-60-03.5-L-4-2-TR |
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7440660035
Würth Elektronik
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1 | Wurth WE-TPC Series Shielded Wire-wound SMD Inductor with a Ferrite Core, 3.5 μH ±30% 6.4A Idc | Other | 7440660035 |
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0466003.NRHF
LITTELFUSE
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1 | Surface Mount Fuses 32V 3A FA HALIDE FREE SLIM | Fuses Chip | 0466003.NRHF |
3
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746600330R
Würth Elektronik
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1 | Wurth Elektronik WP-SMBU PCB Screw Terminal, 50A, Through Hole, M3 | Other | 746600330R |
3
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0466003.
LITTELFUSE
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1 | Surface Mount Fuses 32V 3A FA HALIDE FREE SLIM | Fuses Chip | 0466003. |
3
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N2526-6003RB
3M
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1 | 3M 2500, 2.54mm Pitch, 26 Way, 2 Row, Straight PCB Header, Through Hole | Header, Shrouded - Straight PTH Box | N2526-6003RB |
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N2516-6003RB
3M
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1 | 3M, 2500, 16 Way, 2 Row, Straight PCB Header | Header, Shrouded - Straight PTH Box | N2516-6003RB |
3
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ADF6–60–03.5–L–4–2–A
SAMTEC
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1 | HIGH-DENSITY SLIM BODY ARRAYS (0.635 mm) .025" PITCH | Other | ADF6–60–03.5–L–4–2–A |
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7466003R
Würth Elektronik
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1 | Wurth Elektronik, Screw Terminal, Vertical, 50A | Other | 7466003R |
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73366-0030
Molex
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1 | Molex 73366Series, Right Angle Through Hole MCX Connector jack, 50Ω Impedance, 6GHz | Other | 73366-0030 |
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6600393-4
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Signal Positions 0 | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Thickness .076 MICM | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Current Rating (Max) 42 AMP | Contact Type Blade | PCB Contact Termination Area Plating Material Tin | Power Contact Base Material Tin | Contact Base Mater | 6600393-4 |
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6600310-8
TE Connectivity
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1 | Configuration Features: Number of Power Positions 9 | PCB Mount Orientation Vertical | Number of Positions 33 | Number of Signal Positions 24 | Mating & Unmating Configuration Sequencing | Contact Features: Contact Mating Area Plating Material Thickness 3 MICIN | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Retention Within Housing Without | Contact Current Rating (Max) 42 AMP | Power Contact Base Material Tin | Contact Underplating Material Thickness 5.97 MICM | Contact U | 6600310-8 |
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