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281739-4
TE Connectivity
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1 | 8way 2 row straight HE14 shrouded header | Header, Shrouded - Straight PTH Box | 281739-4 |
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1237394
Phoenix Contact
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1 | SACC-DSI-FSD-4CON-L180 SCOX - Device connector rear mounting, 4-position, Socket, straight, M12-SPEEDCON, D-coding, Wave soldering, Item is lead-free in accordance with RoHS II without Exemption 6c (Pb < 0.1 %) | Other | 1237394 |
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787394-5
TE Connectivity
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1 | Body Features: Shell Plating Material Nickel | Connector Profile Standard | Shell Plating Finish Bright | Primary Product Color Black | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 50 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Tin-Lead over Nickel | Contact Underplating Material Palladium Nickel | Contact Current | Other | 787394-5 |
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B32656T7394K000
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.39uF, 1250V DC, 24mm(W) x 19mm(H) x 42mm(L) | Other | B32656T7394K000 |
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5787394-7
TE Connectivity
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1 | Body Features: Connector Profile Standard | Primary Product Color Black | Shell Plating Finish Bright | Shell Plating Material Nickel over Copper | Configuration Features: Number of Positions 68 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Underplating Material Palladium Nickel | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termina | Other | 5787394-7 |
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15437394AA542
Würth Elektronik
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1 | WL-SIQW SMT Infrared QFN LED Waterclear SMT 3737, Infrared 940nm, 1200mW, 3.2V, 150° | Other | 15437394AA542 |
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1873947
Phoenix Contact
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1 | DMC 1,5/ 3-G1-3,5 P26THR - PCB headers, nominal cross section: 1.5 mm2, color: black, nominal current: 8 A, rated voltage (III/2): 160 V, contact surface: Sn, contact connection type: Pin, number of potentials: 6, number of rows: 2, number of positions: 3, number of connections: 6, product range: DMC 1,5/..-G1-THR, pitch: 3.5 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2.6 mm, number of solder pins per potential: 1, plug-in system: COMBICON DFMC 1,5, | Other | 1873947 |
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1757394
Phoenix Contact
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1 | MSTBA 2,5/17-G-5,08 - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 17, number of rows: 1, number of positions: 17, number of connections: 17, product range: MSTBA 2,5/..-G, pitch: 5.08 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.23 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector patt | Other | 1757394 |
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1717394-2
TE Connectivity
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1 | Body Features: Primary Product Color Black | Configuration Features: Number of Rows 2 | Number of Signal Positions 24 | Number of Positions 24 | PCB Mount Orientation Vertical | Number of Sections 1 | Contact Features: Mating Tab Width .025 INCH | Contact Mating Area Plating Material Tin | Mating Tab Width .64 MM | Mating Tab Thickness .64 MM | Contact Type Tab | Contact Size .63mm | Mating Tab Thickness .025 INCH | Dimensions: Profile Height from PCB 20 MM | Connector Width 41.4 MM | Connector Length 16.2 | Other | 1717394-2 |
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1-2007394-5
TE Connectivity
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1 | SFP+, Cage Assembly with Integrated Connector, .8mm [.032in] Centerline, Signal, Operating Temperature Range -55 – 105 °C [-67 – 221 °F] | Other | 1-2007394-5 |
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CSD97394Q4M
Texas Instruments
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1 | CSD97394Q4M Synchronous Buck NexFET™ Power Stage | Other | CSD97394Q4M |
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1-2007394-7
TE Connectivity
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1 | 160 (20 x 8) Position SFP+ Receptacle with Cage, Ganged (2x4) Connector Press-Fit Through Hole, Right Angle | Other | 1-2007394-7 |
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5787394-8
TE Connectivity
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1 | 80 Position D-Type Receptacle, Female Sockets Connector | Other | 5787394-8 |
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1473940000
Weidmüller
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1 | PCB terminal, 630 V, 17.5 A, Pitch in mm: 7.50, 1.5 mm², Number of poles: 2, PUSH IN with actuator, SMD solder connection, 90°, Tape | Other | 1473940000 |
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B32656T7394J000
TDK
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1 | Metallized Polypropylene Capacitors (MKP/MFP), 0.39uF, 1250V DC, 24mm(W) x 19mm(H) x 42mm(L) | Other | B32656T7394J000 |
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1837394
Phoenix Contact
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1 | CCV 2,5/ 5-GF-LR P20 THR - PCB headers, nominal cross section: 2.5 mm2, color: black, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 5, number of rows: 1, number of positions: 5, number of connections: 5, product range: CCV 2,5/..-GF-LR, pitch: 5 mm, mounting: THR soldering / wave soldering, pin layout: Linear pinning, solder pin [P]: 2 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin | Other | 1837394 |
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5787394-5
TE Connectivity
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1 | Body Features: Shell Plating Finish Bright | Shell Plating Material Nickel over Copper | Primary Product Color Black | Connector Profile Standard | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 50 | Number of Rows 2 | Contact Features: Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Underplating Material Palladium Nickel | Contact Base Material Phos | Other | 5787394-5 |
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787394-7
TE Connectivity
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1 | Body Features: Shell Plating Material Nickel | Primary Product Color Black | Connector Profile Standard | Shell Plating Finish Bright | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 68 | Contact Features: Contact Underplating Material Palladium Nickel | Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Tin-Lead | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Current Rating (Max) | Other | 787394-7 |
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2007394-5
TE Connectivity
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1 | Configuration Features: Number of Ports 8 | Number of Positions 160 | Port Matrix Configuration 2 x 4 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Centerline (Pitch) .032 INCH | Cage Material Nickel Silver | Cen | Other | 2007394-5 |
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2007394-6
TE Connectivity
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1 | SFP+, Cage Assembly with Integrated Connector, .8mm [.032in] Centerline, Signal, Operating Temperature Range -55 – 105 °C [-67 – 221 °F] | Other | 2007394-6 |
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7394-59
Molex
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1 | Barrier Strip Terminal Block, 30A, 1 Row(s), 1 Deck(s) | 7394-59 |
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7394-11
MMD
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1 | Clipped Sine Output Oscillator, 12MHz Nom | 7394-11 |
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7394-07
MMD
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1 | Clipped Sine Output Oscillator, 13MHz Nom | 7394-07 |
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7394-V
Molex
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1 | Barrier Strip Terminal Block, 30A, 1 Row(s), 1 Deck(s) | 7394-V |
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7394-M
Molex
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1 | Barrier Strip Terminal Block, 30A, 1 Row(s), 1 Deck(s) | 7394-M |
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