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AD7478AWARMZ
Analog Devices
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1 | Single Channel Single ADC SAR 1.2Msps 8-bit Serial Automotive 8-Pin MSOP Tube | Small Outline Packages | AD7478AWARMZ |
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B41252A7478M067
TDK
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1 | Snap-in Capacitors, 4700?F/35VDC, 22mm dia x 35mm length | Capacitor, Polarized Radial Diameter | B41252A7478M067 |
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747844-4
TE Connectivity
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1 | Receptacle, Board-to-Board, 9 Position, 2.74 mm [.108 in] Centerline, 2 Row, 1 Connector Shell Size, Round, Standard Profile, PCB D-Sub Connectors | Other | 747844-4 |
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B41231B7478M067
TDK
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1 | Snap-in Capacitors, 4700?F/35VDC, 25.4mm dia x 25mm length | Capacitor, Polarized Radial Diameter | B41231B7478M067 |
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747846-4
TE Connectivity
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1 | Body Features: Assembly Process Feature Material Copper Alloy | Shell Plating Material Tin | Primary Product Color Black | Insert Material Zinc | Mating Retention Feature Material Zinc | Connector Profile Standard | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 25 | Contact Features: Contact Current Rating (Max) 6 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Shape & Form Round | PCB Contact Termination Area Plating Material Tin- | Other | 747846-4 |
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5747844-4
TE Connectivity
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1 | Body Features: Connector Profile Standard | Shell Plating Material Tin | Mating Retention Feature Material Zinc | Insert Material Zinc | Assembly Process Feature Material Copper Alloy | Primary Product Color Black | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 9 | Contact Features: Contact Current Rating (Max) 6 AMP | PCB Contact Termination Area Plating Material Tin | Contact Shape & Form Round | Contact Base Material Phosphor Bronze | Contact Mating Ar | Other | 5747844-4 |
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5747844-6
TE Connectivity
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1 | Body Features: Connector Profile Standard | Mating Feature Material Zinc | Assembly Process Feature Material Copper Alloy | Mating Feature Plating Material Clear Chromate | Primary Product Color Black | Shell Plating Material Tin | Insert Material Zinc | Configuration Features: Number of Rows 2 | Number of Positions 9 | PCB Mount Orientation Right Angle | Contact Features: Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material G | Other | 5747844-6 |
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5747846-4
TE Connectivity
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1 | Body Features: Primary Product Color Black | Shell Plating Material Tin | Mating Retention Feature Material Zinc | Assembly Process Feature Material Brass | Insert Material Zinc | Connector Profile Standard | Configuration Features: Number of Positions 25 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Ma | Other | 5747846-4 |
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B41888C7478M000
TDK
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1 | Aluminum Electrolytic Capacitors - Radial Leaded 35VDC 4700uF 20% STD Leads | Capacitor, Polarized Radial Diameter | B41888C7478M000 |
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5747838-6
TE Connectivity
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1 | Body Features: Mating Feature Material Zinc | Insert Material Zinc | Assembly Process Feature Material Copper Alloy | Shell Plating Material Tin | Connector Profile Standard | Primary Product Color Black | Mating Feature Plating Material Clear Chromate | Configuration Features: Number of Rows 2 | Number of Positions 25 | PCB Mount Orientation Right Angle | Contact Features: Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | | Other | 5747838-6 |
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5747840-5
TE Connectivity
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1 | Body Features: Primary Product Color Black | Connector Profile Standard | Assembly Process Feature Material Copper Alloy | Mating Feature Material Zinc | Insert Material Zinc | Mating Feature Plating Material Clear Chromate | Shell Plating Material Tin | Configuration Features: Number of Positions 9 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Base Material Brass | Contact Current Rating (Max) 6 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mat | Other | 5747840-5 |
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B41252B7478M062
TDK
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1 | Snap-in Capacitors, 4700?F/35VDC, 25.4mm dia x 25mm length | Other | B41252B7478M062 |
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5747841-6
TE Connectivity
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1 | Body Features: Primary Product Color Black | Shell Plating Material Tin | Connector Profile Standard | Insert Material Zinc | Mating Feature Material Zinc | Mating Feature Plating Material Clear Chromate | Assembly Process Feature Material Copper Alloy | Configuration Features: Number of Positions 15 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Material Brass | PCB Contact Termination Area Plating Material T | Other | 5747841-6 |
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B41252B7478M067
TDK
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1 | Snap-in Capacitors, 4700?F/35VDC, 25.4mm dia x 25mm length | Capacitor, Polarized Radial Diameter | B41252B7478M067 |
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B41888C7478M012
TDK
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1 | Aluminum electrolytic capacitor, Single-ended, Long Useful Life - 105 °C,4700uF,35V | Capacitor, Polarized Radial Diameter | B41888C7478M012 |
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5747847-4
TE Connectivity
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1 | Body Features: Shell Plating Material Tin | Connector Profile Standard | Mating Retention Feature Material Zinc | Assembly Process Feature Material Copper Alloy | Primary Product Color Black | Insert Material Zinc | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 37 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Shape & Form Round | PCB Contact Termination Area Plating Materi | Other | 5747847-4 |
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B41231A7478M060
TDK
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1 | Snap-in Capacitors, 4700?F/35VDC, 22mm dia x 30mm length | Capacitor, Polarized Radial Diameter | B41231A7478M060 |
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2074781002
Molex
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1 | KK Plus 396 Header, 3.96mm Pitch, Vertical, Unshrouded, Tin (Sn) Plating, 2 Circuits, with Peg | Other | 2074781002 |
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2074780004
Molex
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1 | KK Plus 396 Header, 3.96mm Pitch, Vertical, Unshrouded, Tin (Sn) Plating, 4 Circuits, without Peg | Other | 2074780004 |
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2074780005
Molex
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1 | KK Plus 396 Header, 3.96mm Pitch, Vertical, Unshrouded, Tin (Sn) Plating, 5 Circuits, without Peg | Other | 2074780005 |
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2074781005
Molex
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1 | KK Plus 396 Header, 3.96mm Pitch, Vertical, Unshrouded, Tin (Sn) Plating, 5 Circuits, with Peg | Other | 2074781005 |
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2074781006
Molex
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1 | KK Plus 396 Header, 3.96mm Pitch, Vertical, Unshrouded, Tin (Sn) Plating, 6 Circuits, with Peg | Other | 2074781006 |
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E-TDA7478AD
STMicroelectronics
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1 | RF Demodulator IC 16-TSSOP (0.173", 4.40mm Width) | Small Outline Packages | E-TDA7478AD |
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747841-4
TE Connectivity
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1 | Body Features: Insert Material Chromate | Assembly Process Feature Material Copper Alloy | Connector Profile Standard | Shell Plating Material Tin | Mating Retention Feature Material Zinc | Primary Product Color Black | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 15 | Number of Rows 2 | Contact Features: Contact Underplating Material Palladium Nickel | Contact Underplating Material Nickel | Contact Shape & Form Round | Contact Mating Area Plating Material Gold | Contact M | Other | 747841-4 |
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1-5747871-6
TE Connectivity
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1 | TE Connectivity AMPLIMITE HD-20 Series 2.743mm Pitch 9 Way Straight PCB D-sub Connector, Plug | Other | 1-5747871-6 |
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![Part Image](["https://www.molex.com/content/dam/molex/molex-dot-com/products/manual/en-us/images/207/207478/2074781002_hires.jpg","https://www.molex.com/content/dam/molex/molex-dot-com/products/manual/en-us/images/207/207478/2074781002_hires.jpg",null])
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![Part Image](["https://www.molex.com/content/dam/molex/molex-dot-com/products/manual/en-us/images/207/207478/2074780005_hires.jpg","https://www.molex.com/content/dam/molex/molex-dot-com/products/manual/en-us/images/207/207478/2074780005_hires.jpg",null])
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