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7834-0000PR
3M
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1 | 34/PCB/2ROW/2.8MM | Other | 7834-0000PR |
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7834-0006PR
3M
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1 | Header | Other | 7834-0006PR |
2
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87834-0611
Molex
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1 | 2.54mm Pitch C-Grid Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-Free, 6 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window | Other | 87834-0611 |
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87834-1411
Molex
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1 | Headers & Wire Housings CGrid Hdr W/Pg/Slt 1 /Slt 1PdNiAuLF 14Ckt | Other | 87834-1411 |
3
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NCV78343DQ0R2G
onsemi
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1 | Single Chip Compatible with IMS Board (Single Layer); 12 Integrated Switches with Multiple Configuration Options; Minimum of External Components; Communication Interfaces to the Pixel Light ECU via; Integrated M−LVDS; UART over CAN Interface; Integrated Bridge between M−LVDS and UART; Supports up to 32 Devices, 1Mbaud; No Need for Local MCU and Precise Clock; Interface to External I2C EEPROM; Integrated 8 bit Analog to Digital Converter; Dimming Controller; PWM + Phase Shift Unit per Channel; Over Temp Prot | Small Outline Packages | NCV78343DQ0R2G |
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0878340619
Molex
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1 | 2.54mm Pitch C-Grid Header, Dual Row, Low Profile, Vertical, Shrouded, 6 Circuits, 0.13µm Gold (Au) Plating, Black, without PCB Locator, without End Window, Center Polarization Slot, Lead-Free | Header, Shrouded - Straight PTH Box | 0878340619 |
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SL10SMD07834Z
Fischer Elektronik GmbH & Co. KG
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1 | 8 position male header double row connectors ,CuSn-alloy, tin-plated 250 V AC ,3 A ,2.54 pitch | Other | SL10SMD07834Z |
3
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SL10SMD07834S
Fischer Elektronik GmbH & Co. KG
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1 | 8 position male header double row connectors ,CuSn-alloy, tin-plated 250 V AC ,3 A ,2.54 pitch | Other | SL10SMD07834S |
3
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87834-2619
Molex
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1 | Headers & Wire Housings CGrid Hdr W/Pg/Slt Pg/Slt .13AuLF 26Ckt, 2.5 A, - 55 C + + 120 C | Other | 87834-2619 |
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87834-2019
Molex
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1 | Headers & Wire Housings CGrid Hdr W/Pg/Slt Pg/Slt .13AuLF 20Ckt | Other | 87834-2019 |
3
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87834-1419
Molex
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1 | 2.54mm Pitch C-Grid Header, Dual Row, Low Profile, Vertical, Shrouded, 14 Circuits, 0.13µm Gold (Au) Plating, Black, without PCB Locator, without End Window, Center Polarization Slot, Lead-Free | Other | 87834-1419 |
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87834-2611
Molex
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1 | Headers & Wire Housings CGrid Hdr W/Pg/Slt 1 /Slt 1PdNiAuLF 26Ckt | Other | 87834-2611 |
3
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AD7834ANZ
Analog Devices
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1 | Digital to Analog Converters - DAC Quad 14 bit serial DAC IC | Dual-In-Line Packages | AD7834ANZ |
3
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78347-2004
Molex
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1 | High Speed / Modular Connectors Impact Pwr 3Pr RAHdr RHDn PF.76AuLF 4Ckt | Other | 78347-2004 |
3
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1783423
Phoenix Contact
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1 | MSTB 2,5/ 6-GU - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 6, number of rows: 1, number of positions: 6, number of connections: 6, product range: MSTB 2,5/..-GU, pitch: 5 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.3 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern alignmen | Other | 1783423 |
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745783-4
TE Connectivity
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1 | Body Features: Shell Plating Material Tin | Primary Product Color Black | Mating Retention Feature Material Zinc | Insert Material Zinc | Connector Profile Standard | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 25 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Tin-Lead | Contact Shape & Form Round | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 6 AMP | Con | Other | 745783-4 |
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5787834-2
TE Connectivity
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1 | Body Features: Shell Plating Material Tin | Shell Plating Finish Bright | Offset 0 MM | Connector Profile Standard | Configuration Features: Number of Ports 1 | Number of Positions 4 | Contact Features: Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.57 MM | PCB Thickness (Recommen | Other | 5787834-2 |
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5747834-6
TE Connectivity
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1 | Body Features: Insert Material Zinc | Connector Profile Standard | Mating Retention Feature Material Zinc | Assembly Process Feature Material Copper Alloy | Primary Product Color Black | Shell Plating Material Tin | Configuration Features: Number of Rows 2 | Number of Positions 25 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 6 AMP | Contact | Other | 5747834-6 |
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SL207834GECO
Fischer Elektronik GmbH & Co. KG
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1 | male header | Other | SL207834GECO |
3
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1783478
Phoenix Contact
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1 | MSTB 2,5/11-GU - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 11, number of rows: 1, number of positions: 11, number of connections: 11, product range: MSTB 2,5/..-GU, pitch: 5 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.3 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern align | Other | 1783478 |
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1783465
Phoenix Contact
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1 | MSTB 2,5/10-GU - PCB headers, nominal cross section: 2.5 mm2, color: green, nominal current: 12 A, rated voltage (III/2): 320 V, contact surface: Sn, contact connection type: Pin, number of potentials: 10, number of rows: 1, number of positions: 10, number of connections: 10, product range: MSTB 2,5/..-GU, pitch: 5 mm, mounting: Wave soldering, pin layout: Linear pinning, solder pin [P]: 3.3 mm, number of solder pins per potential: 1, plug-in system: COMBICON MSTB 2,5, Pin connector pattern align | Other | 1783465 |
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8000078340
Weidmüller
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1 | Hybrid connector (board connection), 7.50 mm, Number of poles: 7, Outgoing elbow: 90° | Other | 8000078340 |
3
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1987834
Phoenix Contact
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1 | PT 2,5/13-5,0-V - Printed circuit board terminal, nominal current: 32 A, rated voltage (III/2): 400 V, nominal cross section: 2.5 mm2, number of potentials: 13, number of rows: 1, number of positions per row: 13, product range: PT 2,5/..-V, pitch: 5 mm, connection method: Screw connection with wire protector, mounting: Wave soldering, conductor/PCB connection direction: 90 °, color: green, Pin layout: Linear pinning, Solder pin [P]: 4.1 mm, number of solder pins per potential: 1, type of packagin | Other | 1987834 |
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UCC27834DR
Texas Instruments
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1 | Gate Drivers 200-V 4-A/4-A -40°C ~ 150°C (TJ) Half- Bridge Driver with I 8-SOIC (0.154", 3.90mm Width) | Small Outline Packages | UCC27834DR |
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TPS78342DDCR
Texas Instruments
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1 | 500-nA IQ, 150-mA, Ultralow Quiescent Current Low-Dropout Linear Regulator | SOT23 (5-Pin) | TPS78342DDCR |
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