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794637-6
TE Connectivity
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1 | Connector Header Surface Mount 6 position 0.118" (3.00mm) | Other | 794637-6 |
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3-794635-6
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 6 | Number of Rows 2 | Number of Positions 6 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Pla | Other | 3-794635-6 |
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3-794618-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | Number of Rows 2 | Number of Power Positions 6 | PCB Mount Orientation Right Angle | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | Other | 3-794618-6 |
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3-794679-6
TE Connectivity
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1 | Connector Header Through Hole, Right Angle 6 position 0.118" (3.00mm) , UL94 V-0 , 250V , -40°C ~ 105°C | Other | 3-794679-6 |
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3-794619-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Positions 6 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Ma | Other | 3-794619-6 |
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3-794677-6
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 6 | Number of Positions 6 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Ma | Other | 3-794677-6 |
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3-794680-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Rows 2 | Number of Positions 6 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types | Other | 3-794680-6 |
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3-794678-6
TE Connectivity
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1 | PCB Mount Header, Right Angle, Wire-to-Board, 6 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Through Hole - Solder, Micro MATE-N-LOK | Other | 3-794678-6 |
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3-794633-6
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 6 | Number of Power Positions 6 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | PCB Contact Terminati | Other | 3-794633-6 |
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3-794632-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | PCB Mount Orientation Vertical | Number of Power Positions 6 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Multiple Contact Types Without | Header, Receptacle - Straight PTH Box | 3-794632-6 |
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3-794631-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | Number of Rows 2 | Number of Positions 6 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Th | Header, Shrouded - Straight PTH Box | 3-794631-6 |
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3-794636-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 6 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 6 | Contact Features: Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating M | Other | 3-794636-6 |
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3-794627-6
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Power Positions 6 | Number of Positions 6 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Wit | Other | 3-794627-6 |
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3-794620-6
TE Connectivity
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1 | Configuration Features: Number of Positions 6 | PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Power Positions 6 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Multiple Contact Types Without | Contact Mating Area Plating Material Gold | PCB Contact Terminat | Other | 3-794620-6 |
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3-794630-6
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 6 | PCB Mount Orientation Vertical | Number of Power Positions 6 | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Multiple Contact Types Without | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickne | Header, Receptacle - Straight PTH Box | 3-794630-6 |
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1-794681-4
TE Connectivity
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1 | CONN HEADER VERT 14POS 3MM | Other | 1-794681-4 |
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1-794680-8
TE Connectivity
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1 | Pin & Socket Connectors 18POS MICRO MNL ASSY VRT,THRU | Other | 1-794680-8 |
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4-794681-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 10 | Number of Rows 2 | Number of Signal Positions 0 | Number of Positions 10 | Contact Features: Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Retention Within Housing Without | Contact Type Pin | Multiple Contact Types Without | Contact Mating Area Plating Mat | Other | 4-794681-0 |
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4-794630-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 12 | Number of Power Positions 12 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | | Other | 4-794630-2 |
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5-794636-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 24 | Number of Power Positions 24 | Number of Rows 2 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Current Rating (Max) 5 AMP | Contact Ty | Other | 5-794636-4 |
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4-794630-6
TE Connectivity
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1 | Configuration Features: Number of Power Positions 16 | PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Retention Within Housing Without | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Without | Contact Mating Area Plating Material Thickn | Other | 4-794630-6 |
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3-794677-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 2 | PCB Mount Orientation Right Angle | Number of Positions 2 | Number of Rows 2 | Number of Signal Positions 0 | Contact Features: Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Contact Current Rating (Max) 5 AMP | M | Other | 3-794677-2 |
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3-794632-8
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 8 | Number of Power Positions 8 | Contact Features: Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Type Pin | PCB Contact Termination Area Plating Material T | Other | 3-794632-8 |
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3-794627-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 4 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | Contact Mating Area Plating Material Thic | Other | 3-794627-4 |
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09794646801
HARTING
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1 | DIN R (HE11) female angled, 64pin, w/ board locks, PL2 (row a loaded) | Other | 09794646801 |
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![Part Image](["https://componentsearchengine.com/2D/0T/16090523.1.3.png",null,null])
![Part Image](["https://www.te.com/content/dam/te-com/catalog/part/037/946/356/3-794635-6-t1.jpg/jcr:content/renditions/product-details.png","https://www.te.com/content/dam/te-com/catalog/part/037/946/356/3-794635-6-t1.jpg/jcr:content/renditions/product-details.png",null])
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![Part Image](["https://componentsearchengine.com/Images/1/1-794681-4.jpg",null,null])
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