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| Image | Part Number | D.S | Description | Package Category | Prices / Stock | Model | Action | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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5-794627-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 24 | Number of Power Positions 24 | Contact Features: PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact Type Pin | Contact Retention Within Housing Without | Multiple Contact Types W | Other | 5-794627-4 |
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3-794627-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 4 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | Contact Mating Area Plating Material Thic | Other | 3-794627-4 |
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3-794620-8
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 8 | Number of Power Positions 8 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 | Other | 3-794620-8 |
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4-794620-2
TE Connectivity
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1 | Configuration Features: Number of Positions 12 | Number of Power Positions 12 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | | Other | 4-794620-2 |
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4-794625-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 10 | Contact Features: Contact Mating Area Plating Material Thickness .38 MICM | Contact Type Pin | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Gold | | Other | 4-794625-0 |
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3-794620-2
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 2 | Number of Positions 2 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness .76 MICM | Contact Type Pin | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | PCB Conta | Other | 3-794620-2 |
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5-794629-4
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Power Positions 24 | Number of Positions 24 | Contact Features: PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact Mating Area Plat | Other | 5-794629-4 |
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3-794627-8
TE Connectivity
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1 | Configuration Features: Number of Positions 8 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 8 | Contact Features: Multiple Contact Types Without | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | | Other | 3-794627-8 |
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5-794620-4
TE Connectivity
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1 | Connector Header Through Hole, Right Angle 24 position 0.118" (3.00mm) | Other | 5-794620-4 |
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5-794628-0
TE Connectivity
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1 | Configuration Features: Number of Positions 20 | Number of Power Positions 20 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Platin | Other | 5-794628-0 |
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4-794627-4
TE Connectivity
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1 | Configuration Features: Number of Power Positions 14 | Number of Rows 2 | Number of Positions 14 | PCB Mount Orientation Right Angle | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Contact C | Other | 4-794627-4 |
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5-794626-0
TE Connectivity
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1 | PCB Mount Header, Right Angle, Wire-to-Board, 20 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Surface Mount, Power, Micro MATE-N-LOK | Other | 5-794626-0 |
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4-794629-4
TE Connectivity
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1 | Configuration Features: Number of Positions 14 | Number of Power Positions 14 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Current Rating (Max) 5 AMP | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Matin | Other | 4-794629-4 |
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4-794627-6
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Positions 16 | Number of Power Positions 16 | PCB Mount Orientation Right Angle | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Current Rating (Max) 5 AMP | Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Ma | Other | 4-794627-6 |
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3-794620-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 4 | Number of Power Positions 4 | Contact Features: Contact Current Rating (Max) 5 AMP | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .76 MI | Other | 3-794620-4 |
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3-794626-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | Number of Power Positions 4 | PCB Mount Orientation Right Angle | Number of Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Multiple Contact Types Without | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 5 AMP | Contact Retention Within Housing Without | Contact | Other | 3-794626-4 |
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3-794627-6
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Power Positions 6 | Number of Positions 6 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 100 – 300 MICIN | Multiple Contact Types Wit | Other | 3-794627-6 |
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4-794627-0
TE Connectivity
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1 | Configuration Features: Number of Power Positions 10 | Number of Rows 2 | Number of Positions 10 | PCB Mount Orientation Right Angle | Contact Features: Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 2.54 – 7.62 MICM | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | Contact Type Pin | Contact Retention Within Housing Withou | Other | 4-794627-0 |
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4-794620-6
TE Connectivity
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1 | PCB Mount Header, Right Angle, Wire-to-Board, 16 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold (Au), Micro MATE-N-LOK | Other | 4-794620-6 |
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4-794628-2
TE Connectivity
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1 | Configuration Features: Number of Power Positions 12 | PCB Mount Orientation Right Angle | Number of Positions 12 | Number of Rows 2 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness .38 MICM | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Thickness 15 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Multiple Contact | Other | 4-794628-2 |
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4-794620-4
TE Connectivity
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1 | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Power Positions 14 | Number of Positions 14 | Contact Features: Multiple Contact Types Without | Contact Mating Area Plating Material Thickness .76 MICM | Contact Current Rating (Max) 5 AMP | PCB Contact Termination Area Plating Material Thickness 150 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Thickness 3.81 MICM | | Other | 4-794620-4 |
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3-794628-8
TE Connectivity
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1 | PCB Mount Header, Right Angle, Wire-to-Board, 8 Position, 3 mm [.118 in] Centerline, Fully Shrouded, Gold, Surface Mount, Power, Micro MATE-N-LOK | Other | 3-794628-8 |
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4-794620-8
TE Connectivity
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1 | 18P MICRO MNL ASSY,R/A,HDR,LF | Other | 4-794620-8 |
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3-794627-2
TE Connectivity
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1 | Connector Header Surface Mount, Right Angle 2 position | Other | 3-794627-2 |
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4-794620-0
TE Connectivity
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1 | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 10 | Number of Power Positions 10 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 150 MICIN | Contact Mating Area Plating Material Gold | Contact Type Pin | Contact Current Rating (Max) 5 AMP | Contact Mating Area Plating Material T | Other | 4-794620-0 |
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