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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	R5F21262SNFP#X6 Renesas Electronics	1	The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21262SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F212BCSNFP#X6 Renesas Electronics	1	The R8C/2B Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/2A Group and R8C/2B Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp	Quad Flat Packages	R5F212BCSNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21264SNFP#X6 Renesas Electronics	1	The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21264SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21272SDFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21272SDFP#X6	3D model available Symbol and footprint available 3	1 Download Model

	R5F21274SDFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21274SDFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21274SNFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21274SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21275SNFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21275SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21275SDFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21275SDFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21276SNFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21276SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21262SYFP#X6 Renesas Electronics	1	16-bit Microcontrollers - MCU R8C26 8+2KB 2.2/5.5V -20 105C 32LQFP T&R	Quad Flat Packages	R5F21262SYFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F212B8SDFP#X6 Renesas Electronics	1	The R8C/2B Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/2A Group and R8C/2B Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp	Quad Flat Packages	R5F212B8SDFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21256SNFP#X6 Renesas Electronics	1	The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21256SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21272SNFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21272SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F212K2SNFP#X6 Renesas Electronics	1	The R8C/2K Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/2H Group and R8C/2J Group of single-chip MCUs incorporate the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the suppo	Quad Flat Packages	R5F212K2SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21266SYFP#X6 Renesas Electronics	1	16-bit Microcontrollers - MCU R8C26 32+2KB 2.2/5.5V -20 105C 32LQFP TR	Quad Flat Packages	R5F21266SYFP#X6	3D model available Symbol and footprint available 3	1 Download Model

	R5F21257SNFP#X6 Renesas Electronics	1	The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21257SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21266SNFP#X6 Renesas Electronics	1	The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21266SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F212L4SNFP#X6 Renesas Electronics	1	The R8C/2L Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/2K Group and R8C/2L Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp	Quad Flat Packages	R5F212L4SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21276SDFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21276SDFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	FPX-6.000MHZ-BBE00010 Fox Electronics	1	Series - Fundamental Quartz Crystal, 6MHz Nom		FPX-6.000MHZ-BBE00010	3D model not available Symbol and footprint not available 0	0 Build or Request
	FPX-6.000MHZ-BBE30010 Fox Electronics	1	Parallel - Fundamental Quartz Crystal, 6MHz Nom		FPX-6.000MHZ-BBE30010	3D model not available Symbol and footprint not available 0	0 Build or Request
	FPX-6.000MHZ-BAE00010 Fox Electronics	1	Series - Fundamental Quartz Crystal, 6MHz Nom		FPX-6.000MHZ-BAE00010	3D model not available Symbol and footprint not available 0	0 Build or Request
	FPX-6.000MHZ-BBE10010 Fox Electronics	1	Parallel - Fundamental Quartz Crystal, 6MHz Nom		FPX-6.000MHZ-BBE10010	3D model not available Symbol and footprint not available 0	0 Build or Request
	FPX-66.6667MHZ Fox Electronics	1	Quartz Crystal		FPX-66.6667MHZ	3D model not available Symbol and footprint not available 0	0 Build or Request
	FPX-6.000MHZ-BAE10010 Fox Electronics	1	Parallel - Fundamental Quartz Crystal, 6MHz Nom		FPX-6.000MHZ-BAE10010	3D model not available Symbol and footprint not available 0	0 Build or Request
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