FPX6- Footprint, Symbol and 3D Model search results

Showing 25 of 157 results

Price & Stock Powered by

Filter by Manufacturer

Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	R5F21264SNFP#X6 Renesas Electronics	1	The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21264SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21262SNFP#X6 Renesas Electronics	1	The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21262SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F212BCSNFP#X6 Renesas Electronics	1	The R8C/2B Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/2A Group and R8C/2B Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp	Quad Flat Packages	R5F212BCSNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21275SNFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21275SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model

	R5F21274SNFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21274SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21274SDFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21274SDFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21275SDFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21275SDFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21272SDFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21272SDFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21262SYFP#X6 Renesas Electronics	1	16-bit Microcontrollers - MCU R8C26 8+2KB 2.2/5.5V -20 105C 32LQFP T&R	Quad Flat Packages	R5F21262SYFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F212B8SDFP#X6 Renesas Electronics	1	The R8C/2B Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.The R8C/2A Group and R8C/2B Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp	Quad Flat Packages	R5F212B8SDFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21256SNFP#X6 Renesas Electronics	1	The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21256SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21272SNFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21272SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F212K2SNFP#X6 Renesas Electronics	1	The R8C/2K Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/2H Group and R8C/2J Group of single-chip MCUs incorporate the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the suppo	Quad Flat Packages	R5F212K2SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21276SNFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21276SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21266SYFP#X6 Renesas Electronics	1	16-bit Microcontrollers - MCU R8C26 32+2KB 2.2/5.5V -20 105C 32LQFP TR	Quad Flat Packages	R5F21266SYFP#X6	3D model available Symbol and footprint available 3	1 Download Model

	R5F21257SNFP#X6 Renesas Electronics	1	The R8C/25 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21257SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F212L4SNFP#X6 Renesas Electronics	1	The R8C/2L Group is supported only for customers who have already adopted these products. The RL78/G1F Group is recommended for new designs.The R8C/2K Group and R8C/2L Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated instructions for a high level of efficiency. With 1Mb of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing.Power consumption is low, and the supp	Quad Flat Packages	R5F212L4SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21266SNFP#X6 Renesas Electronics	1	The R8C/26 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C/Tiny Series CPU core, and are packaged in a 52-pin molded-plastic LQFP or a 64-pin molded-plastic FLGA. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Fu	Quad Flat Packages	R5F21266SNFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	R5F21276SDFP#X6 Renesas Electronics	1	The R8C/27 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1Mb of address space, they are capable of executing instructions at high speed. Furthermore, the R8C/27 Group has on-chip data	Quad Flat Packages	R5F21276SDFP#X6	3D model available Symbol and footprint available 3	1 Download Model
	FPX6-77 CommScope Inc	1	Parabolic Antenna, 7750MHz Min, 8400MHz Max, 40.2dB Gain, 1.5deg 3dB Beamwidth		FPX6-77	3D model not available Symbol and footprint not available 0	0 Build or Request
	FPX6-25 CommScope Inc	1	Parabolic Antenna, 2480MHz Min, 2700MHz Max, 29.6dB Gain, 5deg 3dB Beamwidth		FPX6-25	3D model not available Symbol and footprint not available 0	0 Build or Request
	FPX6-23 CommScope Inc	1	Parabolic Antenna, 2300MHz Min, 2500MHz Max, 28.9dB Gain, 5.5deg 3dB Beamwidth		FPX6-23	3D model not available Symbol and footprint not available 0	0 Build or Request
	FPX6-25C CommScope Inc	1	Parabolic Antenna, 2480MHz Min, 2700MHz Max, 29.6dB Gain		FPX6-25C	3D model not available Symbol and footprint not available 0	0 Build or Request
	FPX6-23C CommScope Inc	1	Parabolic Antenna, 2300MHz Min, 2500MHz Max, 28.9dB Gain		FPX6-23C	3D model not available Symbol and footprint not available 0	0 Build or Request
	FPX6-64 CommScope Inc	1	Parabolic Antenna, 6425MHz Min, 7125MHz Max, 38dB Gain, 1.8deg 3dB Beamwidth		FPX6-64	3D model not available Symbol and footprint not available 0	0 Build or Request
1 2 3 4 5 6 7

Can't find what you're looking for? Request this part

FPX6- Model Download Search Results

Popular Microcontrollers