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Image	Part Number	D.S	Description	Package Category	Prices / Stock	Model	Action
	CL05B103KB5VPJC SAMSUNG	1	General Multilayer Ceramic Capacitors	Capacitor Chip Non-polarised	CL05B103KB5VPJC	3D model available Symbol and footprint available 3	1 Download Model
	K4A8G085WB-BIRC0 SAMSUNG	0	8Gb B-die DDR4 SDRAM	BGA	K4A8G085WB-BIRC0	3D model available Symbol and footprint available 3	1 Download Model
	K4B4G0846D-BYH90 SAMSUNG	1	4Gb D-die DDR3L SDRAM 78FBGA with Lead-Free & Halogen-Free	BGA	K4B4G0846D-BYH90	3D model available Symbol and footprint available 3	1 Download Model
	K9F1G08U0B-PCB00 SAMSUNG	0	128M x 8 Bit NAND Flash Memory	Small Outline Packages	K9F1G08U0B-PCB00	3D model available Symbol and footprint available 3	1 Download Model
	K9G8G08U0M-PCB0 SAMSUNG	1	8G-bit NAND Flash Memory	Small Outline Packages	K9G8G08U0M-PCB0	3D model available Symbol and footprint available 3	1 Download Model
	K4A4G165WE-BCRC SAMSUNG	1	DRAM Chip DDR4 SDRAM 4Gbit 256Mx16 1.2V 96-Pin FBGA	BGA	K4A4G165WE-BCRC	3D model available Symbol and footprint available 3	1 Download Model
	SCP8TT78HPL1TLS06E SAMSUNG	1	LED Uni-Color White 4000K 80 2-Pin Flip-Chip T/R	Other	SCP8TT78HPL1TLS06E	3D model available Symbol and footprint available 3	1 Download Model
	CIGT201610LH2R2MNE SAMSUNG	1	2.2 µH Shielded Thin Film Inductor 1.8 A 139mOhm Max 0806 (2016 Metric)	Inductors Chip	CIGT201610LH2R2MNE	3D model not available Symbol and footprint available 2	1 Download Model
	IRF9Z34 SAMSUNG	1	Mosfet, Power; P-ch; Vdss -55V; Rds(on) 0.1 Ohm; Id -19A;	Transistor Outline, Vertical	IRF9Z34	3D model available Symbol and footprint available 3	1 Download Model
	CL21X107MRYN3WE SAMSUNG	1	General Multilayer Ceramic Capacitors	Capacitor Chip Non-polarised	CL21X107MRYN3WE	3D model available Symbol and footprint available 3	1 Download Model
	K9F2G08U0M-YIB00 SAMSUNG	0	256M x 8 Bit / 128M x 16 Bit / 512M x 8 Bit NAND Flash Memory	Small Outline Packages	K9F2G08U0M-YIB00	3D model available Symbol and footprint available 3	1 Download Model
	K4B8G1646Q-MYK0 SAMSUNG	1	96FBGA with Lead-Free & Halogen-Free	BGA	K4B8G1646Q-MYK0	3D model available Symbol and footprint available 3	1 Download Model
	SPHWH2L3D30CD4RTP3 SAMSUNG	1	LED Lighting LH351B White, Cool 5000K 2.8V 350mA 120° 1414 (3535 Metric)	Other	SPHWH2L3D30CD4RTP3	3D model available Symbol and footprint available 3	1 Download Model
	K4UCE3Q4AB-MGCL SAMSUNG	1	200-Ball Fine pitch Ball Grid Array1.8 / 1.1 / 0.6 V. Temperature: -25 ~ 85 °C FBGA-200.	BGA	K4UCE3Q4AB-MGCL	3D model available Symbol and footprint available 3	1 Download Model
	K4B4G0846D-BCH9 SAMSUNG	1	nc	BGA	K4B4G0846D-BCH9	3D model available Symbol and footprint available 3	1 Download Model
	SPMWH1228MD5WNT0RK SAMSUNG	1	LED Lighting LM281B+ White, Neutral 4000K 2.7V 65mA 120° LED Lighting LM281B+ White, Neutral 4000K 2.7V 65mA 120°	Other	SPMWH1228MD5WNT0RK	3D model available Symbol and footprint available 3	1 Download Model
	CL21F475ZOFNNNE SAMSUNG	1	Multilayer Ceramic Capacitors MLCC - SMD/SMT 4.7uF 16V 0805 RoHS	Capacitor Chip Non-polarised	CL21F475ZOFNNNE	3D model available Symbol and footprint available 3	1 Download Model
	CL03A104KL3NNNC SAMSUNG	1	0.1 µF ±10% 35V Ceramic Capacitor X5R 0201 (0603 Metric)	Capacitor Chip Non-polarised	CL03A104KL3NNNC	3D model available Symbol and footprint available 3	1 Download Model
	CL31B105KCHNFNE SAMSUNG	1	Multilayer Ceramic Capacitors MLCC - SMD/SMT	Capacitor Chip Non-polarised	CL31B105KCHNFNE	3D model available Symbol and footprint available 3	1 Download Model
	CL32E475KCIVPJE SAMSUNG	1	Manufactured by state-of-the-art facilities, recommended for registration of ISO 9001 & IATF 16949AEC-Q200 and JEDEC-020-D qualified products.RoHS compliant products.X7R dielectric components have BME and metal-epoxy terminations with a Ni/Sn plated overcoat.C0G dielectric components contain BME and copper terminations with a Ni/Sn plated overcoat.	Capacitor Chip Non-polarised	CL32E475KCIVPJE	3D model available Symbol and footprint available 3	1 Download Model
	CL05B103KA5VPNC SAMSUNG	1	Cap Ceramic 0.01uF 25V X7R 10% Pad SMD 0402 125°C Automotive T/R	Capacitor Chip Non-polarised	CL05B103KA5VPNC	3D model available Symbol and footprint available 3	1 Download Model
	CL10B103KO8NNNC SAMSUNG	1	Multilayer Ceramic Capacitors MLCC - SMD/SMT	Capacitor Chip Non-polarised	CL10B103KO8NNNC	3D model available Symbol and footprint available 3	1 Download Model
	CL32B106KBJNNNF SAMSUNG	1	Samsung Electro-Mechanics, 1210 (3225M) 10μF Multilayer Ceramic Capacitor MLCC 50V dc ±10% , SMD CL32B106KBJNNNF	Capacitor Chip Non-polarised	CL32B106KBJNNNF	3D model available Symbol and footprint available 3	1 Download Model
	CIS21J121NE SAMSUNG	1	Ferrite Beads Multi-Layer High Current 120Ohm 25% 100MHz 5A 20mOhm DCR 0805 T/R	Ferrite Bead Chip	CIS21J121NE	3D model available Symbol and footprint available 3	1 Download Model
	SPMWHT329FD5YBTMS0 SAMSUNG	1	LED WHT 4000K 80CRI LM3020B SMD	Other	SPMWHT329FD5YBTMS0	3D model not available Symbol and footprint available 2	1 Download Model
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