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5AGXBA1D6F31C6N - Intel

Description: 5AGXBA1D6F31C6N, FPGA Arria V 75000 Cells, 463 kbit, 8000 kbit, 1.07 → 1.13 V 896-Pin FBGA

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5AGXBA1D6F31C6N - Intel PCB footprint - BGA - BGA - 896-Pin FineLine Ball-Grid Array (FBGA)_2021_1
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5AGXBA1D6F31C6N - Intel  - 3D model - BGA - 896-Pin FineLine Ball-Grid Array (FBGA)_2021_1
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5AGXBA1D6F31C6N Details

  • Manufacturer Part Number:

    5AGXBA1D6F31C6N

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FBGA-896

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • JESD-30 Code:

    S-PBGA-B896

  • JESD-609 Code:

    e1

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2830

  • Number of Inputs:

    416

  • Number of Logic Cells:

    75000

  • Number of Outputs:

    416

  • Number of Terminals:

    896

  • Operating Temperature-Max:

    85 °C

  • Organization:

    2830 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA896,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.7 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    28 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    31 mm

5AGXBA1D6F31C6N Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide for the Arria 10 GX FPGA family, which includes the 5AGXBA1D6F31C6N. The guide recommends a 4-6 layer PCB stackup with a minimum of two power planes and two ground planes. It also provides guidelines for signal routing, decoupling, and thermal management.
  • Intel provides a PowerPlay Early Power Estimator (EPE) tool that allows you to estimate power consumption based on your design's specific requirements. You can also use the Quartus II Power Analyzer to optimize power consumption during the design process. Additionally, consider using low-power modes, such as the 'L0' mode, and optimizing clock frequencies and voltage levels.
  • The 5AGXBA1D6F31C6N has a maximum junction temperature of 100°C. To ensure reliable operation, Intel recommends using a heat sink with a thermal interface material, and designing a thermal management system that can dissipate up to 25W of power. You should also consider using thermal sensors and monitoring tools to track the FPGA's temperature.
  • Intel provides a variety of security features, including the ability to encrypt configuration data using the Advanced Encryption Standard (AES). You can also use the FPGA's built-in security features, such as the Secure Device Manager, to protect against unauthorized access and tampering. Additionally, consider using a secure boot mechanism and implementing access controls to prevent unauthorized configuration changes.
  • Intel recommends following best practices for high-speed signal design, including using differential signaling, controlling impedance, and minimizing signal reflections. You should also consider using the FPGA's built-in signal integrity features, such as the Transceiver Toolkit, to optimize signal quality and reduce jitter.

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5AGXBA1D6F31C6N Overview

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Field Programmable Gate Array, 500MHz, 75000-Cell, CMOS, PBGA896