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5CEBA5U19C7N - Intel

Description: Field Programmable Gate Array 5CEBA5 series 4.88 Mbit UBGA-484 1.1V 925MHz

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5CEBA5U19C7N Details

  • Manufacturer Part Number:

    5CEBA5U19C7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, UBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    8

  • JESD-30 Code:

    S-PBGA-B484

  • Length:

    19 mm

  • Number of Inputs:

    224

  • Number of Logic Cells:

    77000

  • Number of Outputs:

    224

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    2908 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.9 mm

  • Supply Voltage-Max:

    1.13 V

  • Supply Voltage-Min:

    1.07 V

  • Supply Voltage-Nom:

    1.1 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 28 nm

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

5CEBA5U19C7N Frequently Asked Questions (FAQs)

  • Intel provides a PCB design guide for the Cyclone V SoC family, which includes the 5CEBA5U19C7N. The guide recommends a 4-6 layer stackup with a minimum of two power planes and two ground planes. It also provides guidelines for signal routing, decoupling, and thermal management.
  • Intel recommends using a POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable reset signal. The POR circuit should be designed to handle power-up and power-down sequences, as well as voltage brownouts and noise.
  • The 5CEBA5U19C7N has a thermal design power (TDP) of 12W. To manage thermal performance, Intel recommends using a heat sink with a thermal interface material (TIM) and ensuring good airflow around the device. The FPGA also has built-in thermal monitoring and shutdown features to prevent overheating.
  • Intel provides a Clocking Architecture Guide for the Cyclone V SoC family, which includes guidelines for clock domain crossing, clock tree synthesis, and clock jitter management. Engineers should also consider using Intel's Quartus II software to optimize clocking architecture for their specific application.
  • The 5CEBA5U19C7N has built-in security features, including AES encryption, secure boot, and a hardware-based root of trust. Engineers should also consider implementing secure firmware and software practices, such as secure key storage and secure communication protocols.

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5CEBA5U19C7N Overview

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