- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for 5M40ZE64C5N
- Part Number 5M40ZE64C5N
- Manufacturer Intel
- Pin Count 65
- Part Category Integrated Circuit
- Package Category Quad Flat Packages
- Footprint Name Quad Flat Packages - 64-Pin Plastic Enhanced Quad Flat (EQFP) - Wire Bond - A:1.20 - D2:4.5
- Released Date Sep 8, 2018
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
5M40ZE64C5N Details
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Manufacturer Part Number:
5M40ZE64C5N
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Rohs Code:
Yes
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Part Life Cycle Code:
Transferred
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Package Description:
9 X 9 MM, 0.40 MM PITCH, LEAD FREE, PLASTIC, EQFP-64
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Country Of Origin:
Mainland China, Malaysia, Taiwan, USA, Vietnam
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ECCN Code:
EAR99
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HTS Code:
8542.39.00.01
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Manufacturer:
Intel Corporation
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YTEOL:
5
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Clock Frequency-Max:
118.3 MHz
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JESD-30 Code:
S-PQFP-G64
5M40ZE64C5N Frequently Asked Questions (FAQs)
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Intel recommends a 4-6 layer PCB stack-up with a minimum of two power planes and two signal layers. A 1-2-1 or 1-2-2-1 layer stack-up is also acceptable. For optimal signal integrity, use a minimum of 10 mils (0.25 mm) spacing between signal traces and a maximum of 10 mils (0.25 mm) via diameter.
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Use the Intel Quartus Prime software to generate a programming file (.sof) and follow the recommended programming flow. Ensure the FPGA is properly powered and clocked before configuration. Use a reliable programming cable and follow the recommended programming voltage and clock frequency.
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The 5M40ZE64C5N has a maximum junction temperature of 100°C. Ensure good airflow around the device, and consider using a heat sink or thermal interface material to reduce thermal resistance. Follow Intel's thermal management guidelines for optimal thermal performance.
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Use the Intel PowerPlay power analysis tool to optimize power consumption. Implement power gating, clock gating, and dynamic voltage and frequency scaling (DVFS) to reduce power consumption. Use decoupling capacitors and follow Intel's power distribution network (PDN) guidelines to reduce power noise.
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Follow Intel's EMI and EMC guidelines for PCB layout, component selection, and shielding. Use EMI filters, chokes, and shielding to reduce EMI emissions. Ensure proper grounding and bonding of the PCB and chassis to reduce EMI susceptibility.
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5M40ZE64C5N Overview
Use the download button to access the 5M40ZE64C5N schematic symbol, PCB footprint, and 3D model.
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