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71V3579S75PFG - Renesas Electronics

Description: The 71V3579 3.3V CMOS SRAM is organized as 256K x 18. The 71V3579 SRAM contains write, data, address and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.

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71V3579S75PFG - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PKG100
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71V3579S75PFG - Renesas Electronics  - 3D model - Quad Flat Packages - PKG100
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71V3579S75PFG Details

  • Manufacturer Part Number:

    71V3579S75PFG

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PKG100

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    7.5 ns

  • Additional Feature:

    FLOW THROUGH ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    117 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    100

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    256KX18

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP100,.63X.87

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE

  • Packing Method:

    TRAY

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reverse Pinout:

    NO

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.03 A

  • Standby Voltage-Min:

    3.14 V

  • Supply Current-Max:

    0.255 mA

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

71V3579S75PFG Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (Renesas Document No. AP-5053) which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The 71V3579S75PFG has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. Additionally, Renesas recommends using thermal vias and a heat sink to further improve thermal management.
  • While the datasheet specifies a maximum clock frequency of 100 MHz, Renesas recommends operating the device at a maximum frequency of 80 MHz to ensure reliable operation and minimize power consumption.
  • The 71V3579S75PFG has a built-in POR circuit, but it requires an external resistor and capacitor to set the POR timing. Renesas provides a POR circuit design guide in their application note (Renesas Document No. AP-5054).
  • Renesas recommends setting the internal voltage regulator to 1.8V or 2.5V, depending on the system requirements. The regulator can be configured using the device's control registers, and Renesas provides a detailed configuration guide in their application note (Renesas Document No. AP-5055).

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71V3579S75PFG Overview

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