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71V3579S75PFG8 - Renesas Electronics

Description: The 71V3579 3.3V CMOS SRAM is organized as 256K x 18. The 71V3579 SRAM contains write, data, address and control registers. The burst mode feature offers the highest level of performance to the system designer, as it can provide four cycles of data for a single address presented to the SRAM.

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71V3579S75PFG8 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PKG100
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71V3579S75PFG8 - Renesas Electronics  - 3D model - Quad Flat Packages - PKG100
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71V3579S75PFG8 Details

  • Manufacturer Part Number:

    71V3579S75PFG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Pin Count:

    100

  • Manufacturer Package Code:

    PKG100

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    7.5 ns

  • Additional Feature:

    FLOW THROUGH ARCHITECTURE

  • Clock Frequency-Max (fCLK):

    117 MHz

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    4718592 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    18

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    100

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    256KX18

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    QFP100,.63X.87

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE

  • Packing Method:

    TR

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reverse Pinout:

    NO

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.03 A

  • Standby Voltage-Min:

    3.14 V

  • Supply Current-Max:

    0.255 mA

  • Supply Voltage-Max (Vsup):

    3.465 V

  • Supply Voltage-Min (Vsup):

    3.135 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

71V3579S75PFG8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guideline in their application note AN1465, which provides detailed information on thermal management and PCB layout considerations for the 71V3579S75PFG8.
  • The 71V3579S75PFG8 has an internal POR and BOD circuitry. The device will automatically reset when the power supply voltage falls below the POR threshold (typically 1.2V). For BOD, the device will reset when the power supply voltage falls below the BOD threshold (typically 2.2V). No external components are required for POR and BOD implementation.
  • The maximum operating frequency for the 71V3579S75PFG8 is 133 MHz. However, the device can operate at frequencies up to 166 MHz with reduced voltage and temperature derating.
  • The 71V3579S75PFG8 has several low-power modes, including Idle, Sleep, and Power-Down modes. These modes can be configured using the device's control registers. Refer to the datasheet and application notes for specific configuration and programming details.
  • Renesas recommends using a 0.1uF decoupling capacitor placed as close as possible to the device's power pins (VCC and GND). Additional decoupling capacitors may be required depending on the specific application and PCB layout.

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71V3579S75PFG8 Overview

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