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7201LA15TPGI - Renesas Electronics

Description: FIFO 512 x 9 AsyncFIFO 5.0V 9 Dual 12ns

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7201LA15TPGI - Renesas Electronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - PTG28
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7201LA15TPGI - Renesas Electronics  - 3D model - Dual-In-Line Packages - PTG28
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7201LA15TPGI Details

  • Manufacturer Part Number:

    7201LA15TPGI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Factory Lead Time:

    26 Weeks, 1 Day

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    15 ns

  • Additional Feature:

    RETRANSMIT

  • Clock Frequency-Max (fCLK):

    40 MHz

  • Cycle Time:

    25 ns

  • JESD-30 Code:

    R-PDIP-T28

  • JESD-609 Code:

    e3

  • Length:

    34.671 mm

  • Memory Density:

    4608 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    9

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    512 words

  • Number of Words Code:

    512

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512X9

  • Output Characteristics:

    3-STATE

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.572 mm

  • Standby Current-Max:

    0.005 A

  • Supply Current-Max:

    0.08 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

7201LA15TPGI Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (APN) documents, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • Renesas recommends using an external overcurrent protection circuit, such as a current sense resistor and a comparator, to detect overcurrent conditions. The datasheet provides guidelines for selecting the current sense resistor value and setting the overcurrent threshold.
  • Renesas recommends a power-up sequence that involves applying the power supply voltage (VCC) before the input voltage (VIN) to ensure proper device operation and prevent latch-up. The datasheet provides a detailed power-up sequence diagram.
  • Renesas provides a troubleshooting guide in their application note (APN) documents, which includes steps to identify and resolve common issues, such as checking the power supply voltage, input voltage, and output voltage, as well as verifying the device's operating conditions and configuration.
  • Renesas recommends considering thermal design factors such as junction-to-case thermal resistance, thermal interface material, and heat sink design to ensure reliable operation in high-temperature applications. The datasheet provides thermal design guidelines and thermal resistance values.

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7201LA15TPGI Overview

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Part Image 7201LA15TPGI Integrated Device Technology Inc

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Part Image IDT7201LA15TDG Renesas Electronics Corporation

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