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72T36135ML5BB - Renesas Electronics

Description: The 72T36135M is a 512K x 36 TeraSync 2.5V FIFO memory with clocked read and write controls and a wide extended x 36 bus to allow ample data flow. TeraSync FIFOs are particularly appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data at very high performance. There are two possible timing modes of operation with these devices: IDT Standard mode and First Word Fall Through mode.

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72T36135ML5BB - Renesas Electronics PCB footprint - BGA - BGA - BB240-1
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72T36135ML5BB - Renesas Electronics  - 3D model - BGA - BB240-1
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72T36135ML5BB Details

  • Manufacturer Part Number:

    72T36135ML5BB

  • Brand Name:

    Renesas

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PBGA

  • Package Description:

    19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240

  • Pin Count:

    240

  • Manufacturer Package Code:

    BB240

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    3.6 ns

  • Clock Frequency-Max (fCLK):

    200 MHz

  • Cycle Time:

    5 ns

  • JESD-30 Code:

    S-PBGA-B240

  • JESD-609 Code:

    e0

  • Length:

    19 mm

  • Memory Density:

    18874368 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    240

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    512KX36

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA240,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    225

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.76 mm

  • Standby Current-Max:

    0.14 A

  • Supply Current-Max:

    0.18 mA

  • Supply Voltage-Max (Vsup):

    2.625 V

  • Supply Voltage-Min (Vsup):

    2.375 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    19 mm

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72T36135ML5BB Overview

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Part Image 72T36135ML5BB Integrated Device Technology Inc

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Part Image 72T36135ML5BBG Renesas Electronics Corporation

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Part Image IDT72T36135ML5BBG Renesas Electronics Corporation

FIFO, 512KX36, 3.6ns, Synchronous, CMOS, PBGA240