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72V3690L6PFG8 - Renesas Electronics

Description: The 72V3690 32K x 36 SuperSync II FIFO memory with clocked read and write controls offers flexible Bus-Matching x36/x18/x9 data flow and Asynchronous/Synchronous translation on the read or write ports ; SuperSync II FIFO's are appropriate for network, video, telecommunications, data communications and other applications that need to buffer large amounts of data and match busses of unequal sizes.

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72V3690L6PFG8 - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - pkg128
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72V3690L6PFG8 Details

  • Manufacturer Part Number:

    72V3690L6PFG8

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TQFP

  • Pin Count:

    128

  • Manufacturer Package Code:

    PKG128

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    4 ns

  • Additional Feature:

    RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE

  • Clock Frequency-Max (fCLK):

    166 MHz

  • Cycle Time:

    6 ns

  • JESD-30 Code:

    R-PQFP-G128

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Memory Density:

    1179648 bit

  • Memory IC Type:

    OTHER FIFO

  • Memory Width:

    36

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    128

  • Number of Words:

    32768 words

  • Number of Words Code:

    32000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    32KX36

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP128,.63X.87,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Standby Current-Max:

    0.015 A

  • Supply Current-Max:

    0.04 mA

  • Supply Voltage-Max (Vsup):

    3.45 V

  • Supply Voltage-Min (Vsup):

    3.15 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

72V3690L6PFG8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (AN1844) for the 72V3690L6PFG8, which includes thermal design considerations, such as thermal vias, copper pours, and component placement.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, use a suitable thermal interface material, and consider using a heat sink or thermal management system. Additionally, consult Renesas' thermal design guidelines and application notes for specific guidance.
  • The datasheet provides general guidelines for input and output capacitors, but for specific requirements, consult Renesas' application notes (AN1844 and AN1845) which provide detailed information on capacitor selection, including recommended values, types, and placement.
  • Renesas provides troubleshooting guides and application notes (AN1846 and AN1847) that cover common issues, such as oscillations or instability, and provide guidance on how to identify and resolve them. Additionally, consult the datasheet and contact Renesas' technical support for further assistance.
  • The datasheet provides general information on the internal regulators and voltage references, but for specific settings and configuration, consult Renesas' application notes (AN1844 and AN1845) which provide detailed information on recommended settings, calibration, and configuration.

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72V3690L6PFG8 Overview

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