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72V82L15PAG8 - Renesas Electronics

Description: FIFO 1K x 9 DualAsync FIFO 3.3V 15ns

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72V82L15PAG8 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 56 PIN _TSSOP
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72V82L15PAG8 - Renesas Electronics  - 3D model - Small Outline Packages - 56 PIN _TSSOP
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72V82L15PAG8 Details

  • Manufacturer Part Number:

    72V82L15PAG8

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    15 ns

  • Additional Feature:

    RETRANSMIT

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Memory Density:

    9216 bit

  • Memory IC Type:

    BI-DIRECTIONAL FIFO

  • Memory Width:

    9

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Number of Words:

    1024 words

  • Number of Words Code:

    1000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    1KX9

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    6.1 mm

72V82L15PAG8 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (AN) documents, which includes guidelines for thermal vias, copper pours, and component placement to ensure optimal thermal performance.
  • Renesas recommends following the guidelines in their reliability handbook, which includes information on derating, thermal management, and component selection to ensure reliable operation in high-temperature environments.
  • Renesas provides recommended power-up and power-down sequences in their application notes, which include guidelines for voltage sequencing, ramp rates, and timing to ensure safe and reliable operation.
  • Renesas provides troubleshooting guides and FAQs on their website, which include common issues, symptoms, and solutions. Additionally, engineers can contact Renesas' technical support team for further assistance.
  • Yes, Renesas provides guidelines for EMI/EMC design considerations in their application notes, which include information on layout, shielding, and filtering to minimize electromagnetic interference and ensure compliance with regulatory standards.

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72V82L15PAG8 Overview

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