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72V82L20PAGI8 - Renesas Electronics

Description: FIFO 1K x 9 DualAsync FIFO 3.3V 15ns

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72V82L20PAGI8 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 56 PIN _TSSOP
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72V82L20PAGI8 - Renesas Electronics  - 3D model - Small Outline Packages - 56 PIN _TSSOP
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72V82L20PAGI8 Details

  • Manufacturer Part Number:

    72V82L20PAGI8

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.71

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Access Time-Max:

    20 ns

  • Additional Feature:

    RETRANSMIT

  • JESD-30 Code:

    R-PDSO-G56

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Memory Density:

    9216 bit

  • Memory IC Type:

    BI-DIRECTIONAL FIFO

  • Memory Width:

    9

  • Number of Functions:

    1

  • Number of Terminals:

    56

  • Number of Words:

    1024 words

  • Number of Words Code:

    1000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1KX9

  • Output Enable:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    6.1 mm

72V82L20PAGI8 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the 72V82L20PAGI8 is -40°C to 125°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade if operated outside this range.
  • To ensure proper power and decoupling, follow the recommended power supply and decoupling capacitor values specified in the datasheet. Additionally, use a low-ESR capacitor (e.g., ceramic or film capacitor) with a value of at least 10nF, placed as close as possible to the VCC pin.
  • The maximum clock frequency supported by the 72V82L20PAGI8 is 20 MHz, as specified in the datasheet. However, the actual clock frequency may be limited by the system's design and the quality of the clock signal.
  • To handle the JTAG interface, ensure that the TCK pin is driven by a clock signal with a frequency not exceeding 10 MHz. Also, use a JTAG adapter or debugger that supports the IEEE 1149.1 standard, and follow the recommended JTAG signal timing and voltage levels specified in the datasheet.
  • When designing the PCB layout and routing, ensure that the 72V82L20PAGI8's power and ground pins are connected to a solid power plane and ground plane, respectively. Also, keep signal traces short and away from noise sources, and use a 4-layer or 6-layer PCB to minimize noise and crosstalk.

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72V82L20PAGI8 Overview

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