23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484
HTS Code:
8542.31.00.60
Manufacturer:
Microsemi Corporation (now Microchip)
Clock Frequency-Max:
350 MHz
JESD-30 Code:
S-PBGA-B484
JESD-609 Code:
e1
Length:
23 mm
Moisture Sensitivity Level:
3
Number of CLBs:
24576
Number of Equivalent Gates:
1000000
Number of Terminals:
484
Operating Temperature-Max:
100 °C
Operating Temperature-Min:
-40 °C
Organization:
24576 CLBS, 1000000 GATES
Package Body Material:
PLASTIC/EPOXY
Package Code:
BGA
Package Shape:
SQUARE
Package Style:
GRID ARRAY
Peak Reflow Temperature (Cel):
250
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status:
Not Qualified
Seated Height-Max:
2.44 mm
Supply Voltage-Max:
1.575 V
Supply Voltage-Min:
1.425 V
Supply Voltage-Nom:
1.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
TIN SILVER COPPER
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
30
Width:
23 mm
A3P1000-FGG484I Frequently Asked Questions (FAQs)
Microsemi recommends a 4-6 layer PCB stackup with a minimum of two power planes and two signal layers. A 3.3V power plane is recommended for the FPGA core, and a 1.2V power plane for the PLLs. Decoupling capacitors should be placed close to the FPGA, and signal traces should be routed away from the FPGA's high-speed interfaces.
A POR circuit can be implemented using a voltage supervisor IC (e.g., TLV7031) connected to the FPGA's POR pin. The supervisor IC monitors the power supply voltage and asserts the POR signal when the voltage reaches a minimum threshold (e.g., 1.2V). The POR signal should be filtered to prevent glitches and ensure a clean reset.
The FPGA's thermal design power (TDP) is 6W. To manage heat, use a heat sink with a thermal interface material (TIM) and ensure good airflow around the FPGA. The PCB should have thermal vias to dissipate heat from the FPGA to the heat sink. A thermal analysis should be performed to ensure the FPGA operates within its recommended temperature range (0°C to 85°C).
Use controlled impedance traces, and ensure signal integrity by following the PCB layout guidelines in the datasheet. Use differential pairs for high-speed signals, and add series termination resistors to reduce signal reflections. Also, use a signal integrity analysis tool to simulate and optimize the signal transmission.
The FPGA's clock management and PLL configuration should be set according to the specific application requirements. The PLL settings can be configured using the Microsemi Libero SoC design software. The clock frequency, clock source, and PLL settings should be carefully selected to ensure reliable and stable clock operation.
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