13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144
HTS Code:
8542.31.00.60
Manufacturer:
Microsemi Corporation (now Microchip)
Clock Frequency-Max:
350 MHz
JESD-30 Code:
S-PBGA-B144
JESD-609 Code:
e1
Length:
13 mm
Moisture Sensitivity Level:
3
Number of CLBs:
6144
Number of Equivalent Gates:
250000
Number of Terminals:
144
Operating Temperature-Max:
85 °C
Organization:
6144 CLBS, 250000 GATES
Package Body Material:
PLASTIC/EPOXY
Package Code:
LBGA
Package Equivalence Code:
BGA144,12X12,40
Package Shape:
SQUARE
Package Style:
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel):
260
Programmable Logic Type:
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status:
Not Qualified
Seated Height-Max:
1.55 mm
Supply Voltage-Max:
1.575 V
Supply Voltage-Min:
1.425 V
Supply Voltage-Nom:
1.5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
COMMERCIAL
Terminal Finish:
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form:
BALL
Terminal Pitch:
1 mm
Terminal Position:
BOTTOM
Time@Peak Reflow Temperature-Max (s):
30
Width:
13 mm
A3P250-FGG144 Frequently Asked Questions (FAQs)
Microsemi recommends a 4-6 layer PCB stackup with a minimum of two power planes and two signal layers. A 3.3V power plane is recommended for the FPGA core, and a 1.2V power plane for the PLLs. Decoupling capacitors should be placed close to the FPGA, and signal traces should be routed away from the FPGA's high-speed interfaces.
A POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which monitors the 3.3V power rail and asserts a reset signal to the FPGA when the voltage is below a certain threshold. The POR circuit should be designed to ensure a clean reset signal and to prevent brown-out conditions.
The A3P250-FGG144 has a maximum junction temperature of 100°C. To ensure reliable operation, a heat sink or thermal interface material should be used to dissipate heat. A thermal analysis should be performed to determine the optimal heat sink design and thermal interface material. Additionally, the PCB should be designed to minimize thermal resistance and ensure good airflow.
To minimize jitter and skew, the clocking architecture should be designed to use a single, high-quality clock source, such as a crystal oscillator or a low-jitter clock generator. The clock signal should be routed as a differential pair, and clock buffers should be used to minimize clock skew. Additionally, the FPGA's clocking resources, such as the PLLs and clock managers, should be used to generate and distribute clock signals.
To ensure reliable high-speed interface operation, the PCB should be designed to minimize signal reflections, crosstalk, and electromagnetic interference (EMI). This can be achieved by using controlled impedance traces, differential signaling, and EMI shielding. Additionally, the FPGA's high-speed interfaces, such as the SERDES and PCIe interfaces, should be configured and optimized for the specific application.
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A3P250-FGG144 Overview
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