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APA300-PQ208I - Microsemi Corporation

Description: MSWAPA300-PQ208I

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APA300-PQ208I - Microsemi Corporation - PCB symbol
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PCB Footprints
APA300-PQ208I - Microsemi Corporation PCB footprint - Quad Flat Packages - Quad Flat Packages - 208 PQFP
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APA300-PQ208I - Microsemi Corporation - 3D model - Quad Flat Packages - 208 PQFP
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APA300-PQ208I Details

  • Manufacturer Part Number:

    APA300-PQ208I

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    0.50 MM PITCH, PLASTIC, QFP-208

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • YTEOL:

    0

  • Clock Frequency-Max:

    180 MHz

  • JESD-30 Code:

    S-PQFP-G208

  • JESD-609 Code:

    e0

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    3

  • Number of Equivalent Gates:

    300000

  • Number of Inputs:

    158

  • Number of Logic Cells:

    8192

  • Number of Outputs:

    158

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    300000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FQFP

  • Package Equivalence Code:

    QFP208,1.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, FINE PITCH

  • Peak Reflow Temperature (Cel):

    225

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.1 mm

  • Supply Voltage-Max:

    2.7 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    28 mm

APA300-PQ208I Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The APA300-PQ208I should be placed near a thermal pad or heat sink to ensure efficient heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Additionally, consider using a thermal shield or heat sink with a thermal conductivity of at least 1 W/m-K.
  • The APA300-PQ208I can withstand voltage transients up to 1.5 times the maximum rated voltage for a duration of up to 100 ms. However, it's recommended to use a voltage transient filter or a TVS diode to protect the device from voltage spikes.
  • The APA300-PQ208I is not radiation-hardened and is not suitable for use in high-radiation environments. If radiation tolerance is required, consider using a radiation-hardened equivalent or consulting with a Microsemi Corporation representative.
  • Use a human-body model (HBM) ESD protection device with a minimum rating of 2 kV and a clamp voltage of 10 V. Additionally, ensure that the PCB layout and component placement minimize the risk of ESD damage.

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APA300-PQ208I Overview

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APA300-PQ208I Alternates

Showing results

Image Part Number Model
Part Image APA300-PQG208I Actel Corporation

Field Programmable Gate Array, 300000 Gates, 180MHz, 8192-Cell, CMOS, PQFP208
Part Image APA300-PQ208I Actel Corporation

Field Programmable Gate Array, 300000 Gates, 180MHz, 8192-Cell, CMOS, PQFP208
Part Image APA300-PQG208I Microchip Technology Inc

Field Programmable Gate Array, 300000 Gates, 180MHz, 8192-Cell, CMOS, PQFP208
Part Image APA300-PQ208M Microsemi Corporation (now Microchip)

Field Programmable Gate Array, 300000 Gates, 180MHz, 8192-Cell, CMOS, PQFP208
Part Image APA300-PQG208 Microchip Technology Inc

Field Programmable Gate Array, 300000 Gates, 180MHz, 8192-Cell, CMOS, PQFP208
For a full list of alternate parts for APA300-PQ208I, check out Findchips.com