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APA600-BG456 - Microsemi Corporation

Description: IC FPGA 356 I/O 456BGA

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APA600-BG456 - Microsemi Corporation - PCB symbol
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PCB Footprints
APA600-BG456 - Microsemi Corporation PCB footprint - BGA - BGA - BG456
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3D Models
APA600-BG456 - Microsemi Corporation - 3D model - BGA - BG456
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APA600-BG456 Details

  • Manufacturer Part Number:

    APA600-BG456

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    1.27 MM PITCH, PLASTIC, BGA-456

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Clock Frequency-Max:

    180 MHz

  • JESD-30 Code:

    S-PBGA-B456

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    3

  • Number of Equivalent Gates:

    600000

  • Number of Inputs:

    356

  • Number of Logic Cells:

    21504

  • Number of Outputs:

    356

  • Number of Terminals:

    456

  • Operating Temperature-Max:

    70 °C

  • Organization:

    600000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA456,26X26,50

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.54 mm

  • Supply Voltage-Max:

    2.7 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

APA600-BG456 Frequently Asked Questions (FAQs)

  • Microsemi recommends a 4-layer PCB with a solid ground plane, and thermal vias under the device to dissipate heat. A thermal pad on the bottom of the package should be connected to a thermal plane on the PCB.
  • Use a heat sink or thermal management system to keep the junction temperature below 150°C. Ensure good airflow, and consider using a thermal interface material between the device and heat sink.
  • Use low-ESR capacitors with a minimum capacitance of 10uF for input and output filtering. The capacitors should be placed close to the device and connected to the correct pins (VIN, VOUT, and GND).
  • Check the input voltage, output load, and PCB layout for any issues. Verify that the device is properly soldered and that there are no shorts or opens on the PCB. Use an oscilloscope to monitor the output voltage and current.
  • Yes, use a shielded enclosure and ensure good grounding of the PCB. Place EMI filters or ferrite beads on the input and output lines to reduce electromagnetic interference.

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APA600-BG456 Overview

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APA600-BG456 Alternates

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Image Part Number Model
Part Image APA600-BG456I Microchip Technology Inc

Field Programmable Gate Array, 600000 Gates, 180MHz, 21504-Cell, CMOS, PBGA456
Part Image APA600-BG456M Microchip Technology Inc

Field Programmable Gate Array, 600000 Gates, 180MHz, 21504-Cell, CMOS, PBGA456
Part Image APA600-BG456 Microchip Technology Inc

Field Programmable Gate Array, 600000 Gates, 180MHz, 21504-Cell, CMOS, PBGA456
Part Image APA600-BGG456I Microsemi Corporation (now Microchip)

Field Programmable Gate Array, 600000 Gates, 180MHz, 21504-Cell, CMOS, PBGA456
Part Image APA600-BG456 Actel Corporation

Field Programmable Gate Array, 600000 Gates, 180MHz, 21504-Cell, CMOS, PBGA456
For a full list of alternate parts for APA600-BG456, check out Findchips.com