- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for CMF5515K000BHEB
- Part Number CMF5515K000BHEB
- Manufacturer Vishay
- Pin Count 2
- Part Category Resistor
- Package Category Resistors, Axial Diameter Horizontal Mounting
- Footprint Name Resistors, Axial Diameter Horizontal Mounting - CMF55-6
- Released Date Jun 22, 2021
- Last Modified Date Oct 26, 2023 6:27 AM UTC
- Pinout / Pin List Click Here (Member Only)
CMF5515K000BHEB Details
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Manufacturer Part Number:
CMF5515K000BHEB
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
AXIAL LEADED
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Reach Compliance Code:
Not Compliant
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.90
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Factory Lead Time:
8 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
9
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Additional Feature:
PRECISION
CMF5515K000BHEB Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the CMF5515K000BHEB can be found in the Vishay Intertechnologies' application note AN42171, which provides a detailed layout and land pattern recommendation for optimal performance and reliability.
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To ensure the CMF5515K000BHEB operates within its specified temperature range, it's essential to provide adequate heat sinking and thermal management. This can be achieved by using a heat sink with a thermal resistance of ≤ 10°C/W, and ensuring good airflow around the component.
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The maximum allowable voltage derating for the CMF5515K000BHEB is typically 80% of the rated voltage. However, it's recommended to consult with Vishay Intertechnologies' application engineers or refer to the device's reliability report for specific derating guidelines.
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The CMF5515K000BHEB is a commercial-grade component, but Vishay Intertechnologies offers a range of high-reliability and aerospace-grade components that meet specific industry standards (e.g., MIL-PRF-55342). It's recommended to consult with Vishay's application engineers to determine the best component for your specific application.
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The CMF5515K000BHEB is a moisture-sensitive device (MSD). To prevent damage, it's essential to store the components in a dry environment (≤ 30% RH) and handle them according to IPC/JEDEC J-STD-033 standards. Baking the components before reflow soldering is also recommended.
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CMF5515K000BHEB Overview
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