The recommended PCB footprint for CMF601M0000FHEK is a rectangular pad with dimensions of 5.08 mm x 3.81 mm, with a thermal pad of 2.54 mm x 2.54 mm in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) thermal pad.
To ensure reliable soldering of CMF601M0000FHEK, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the PCB pad, and use a reflow oven or a hot air gun to solder the component.
The maximum operating temperature range for CMF601M0000FHEK is -55°C to 150°C. However, the device is typically rated for operation up to 125°C, and derating may be required for higher temperatures.
To handle ESD protection for CMF601M0000FHEK, use an ESD wrist strap or mat, and ensure that the PCB and components are properly grounded. Handle the component by the body or the leads, avoiding direct contact with the die. Use an ESD-safe storage container and packaging materials.
The recommended storage condition for CMF601M0000FHEK is in a dry, cool place with a temperature range of 20°C to 30°C and humidity below 60%. Avoid exposing the component to direct sunlight, moisture, or extreme temperatures.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
CMF601M0000FHEK Overview
Use the download button to access the CMF601M0000FHEK schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like CMF60,
or try a keyword search, such as Fixed Resistors
