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DS3695N - Texas Instruments

Description: 1/1 Transceiver Half RS422, RS485 8-PDIP

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DS3695N - Texas Instruments PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - PDIP 8 PIN
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DS3695N - Texas Instruments  - 3D model - Dual-In-Line Packages - PDIP 8 PIN
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DS3695N Details

  • Manufacturer Part Number:

    DS3695N

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    DIP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    COMMON I/O; 1 RECEIVER ACTIVE UNDER SHUTDOWN; TRISTATABLE RECEIVER

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.817 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    1.5 V

  • Output Low Current-Max:

    0.016 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    37 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max:

    60 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    22 ns

  • Width:

    7.62 mm

DS3695N Frequently Asked Questions (FAQs)

  • TI recommends a 4-layer PCB with a solid ground plane, and to keep the analog and digital signals separate. Use a star topology for the power supply, and keep the input and output traces short and symmetrical.
  • To minimize power consumption, use the lowest possible supply voltage, disable the internal voltage regulator, and use the shutdown pin to turn off the device when not in use. Also, optimize the external component values and reduce the switching frequency.
  • The DS3695N has a thermal pad that must be connected to a thermal relief pattern on the PCB. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Monitor the junction temperature and reduce the power consumption if it exceeds 125°C.
  • Use an oscilloscope to monitor the input and output signals, and check for proper power supply and ground connections. Verify the correct configuration of the device and check for any layout or routing issues. Consult the datasheet and application notes for troubleshooting guides.
  • Handle the device by the body or pins, avoiding direct contact with the die. Use an ESD wrist strap or mat, and store the device in an anti-static bag. Follow proper PCB assembly and handling procedures to prevent ESD damage.

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DS3695N Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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For a full list of alternate parts for DS3695N, check out Findchips.com