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DS90C032BTMX - Texas Instruments

Description: LVDS Interface IC LVDS quad CMOS differential line receiver 16-SOIC -40 to 85

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DS90C032BTMX - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16)
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DS90C032BTMX - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G16)
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DS90C032BTMX Details

  • Manufacturer Part Number:

    DS90C032BTMX

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e0

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    3.5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.002 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    235

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    6 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    11 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    3.9 mm

DS90C032BTMX Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the DS90C032BTMX datasheet, but it's also recommended to follow the guidelines in the 'High-Speed Layout Guidelines' application note (SLWC061) for optimal performance.
  • To ensure signal integrity, it's essential to follow proper PCB design and layout practices, such as using controlled impedance traces, minimizing trace lengths, and using termination resistors. Additionally, use the IBIS model provided by Texas Instruments to simulate and optimize the signal integrity of your design.
  • The maximum cable length supported by the DS90C032BTMX depends on the specific application and the type of cable used. As a general guideline, Texas Instruments recommends a maximum cable length of 10 meters for FPD-Link III applications. However, it's essential to perform signal integrity analysis and testing to determine the maximum cable length for your specific use case.
  • The DS90C032BTMX can be configured using the I2C interface or through the use of external resistors. Texas Instruments provides a configuration guide in the datasheet, as well as a software development kit (SDK) that includes a configuration tool and example code to help you get started.
  • The power consumption of the DS90C032BTMX depends on the specific operating mode and frequency. According to the datasheet, the typical power consumption is around 150 mW at 100 MHz. However, it's essential to consult the datasheet and perform power analysis to determine the exact power consumption for your specific application.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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