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EP2S15F484C3N - Intel

Description: FPGA, STRATIX II

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PCB Footprints
EP2S15F484C3N - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip
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EP2S15F484C3N - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip
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EP2S15F484C3N Details

  • Manufacturer Part Number:

    EP2S15F484C3N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    23 X 23 MM, 1 MM PITCH, FBGA-484

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    717 MHz

  • Combinatorial Delay of a CLB-Max:

    4.45 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    6240

  • Number of Inputs:

    342

  • Number of Logic Cells:

    15600

  • Number of Outputs:

    334

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    6240 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

EP2S15F484C3N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for EP2S15F484C3N is -40°C to 100°C.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the MAX809, which can detect power-on and power-down sequences and generate a reset signal to the FPGA.
  • The recommended clocking scheme for EP2S15F484C3N is to use a single clock source, such as a crystal oscillator, and distribute it to the FPGA's clock networks using the built-in clock management circuitry.
  • Optimizing the pin-out and floorplanning for EP2S15F484C3N involves using Intel's Quartus II software to analyze the design's requirements and optimize the placement of logic elements, I/O pins, and clock networks.
  • Guidelines for PCB layout and signal integrity for EP2S15F484C3N include using a multi-layer PCB, separating analog and digital signals, and using controlled impedance traces and terminations to minimize signal reflections and crosstalk.

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EP2S15F484C3N Overview

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Part Image EP2S15F484C3 Altera Corporation

Field Programmable Gate Array, 6240 CLBs, 717MHz, 15600-Cell, CMOS, PBGA484