Part Image

EP4CE75U19I7N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone IV E 4713 LABs 292 IOs

Download EP4CE75U19I7N Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
EP4CE75U19I7N - Intel PCB footprint - BGA - BGA - 484-bga
click to zoom
3D Models
EP4CE75U19I7N - Intel  - 3D model - BGA - 484-bga
click to zoom

EP4CE75U19I7N Details

  • Manufacturer Part Number:

    EP4CE75U19I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    LEAD FREE, UBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    4713

  • Number of Inputs:

    292

  • Number of Logic Cells:

    75408

  • Number of Outputs:

    292

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4713 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.05 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

EP4CE75U19I7N Frequently Asked Questions (FAQs)

  • The EP4CE75U19I7N has an operating temperature range of -40°C to 100°C.
  • Intel recommends using a synchronizer or a FIFO to implement CDC in the EP4CE75U19I7N. The specific implementation depends on the clock frequencies and data transfer requirements.
  • The maximum frequency achievable with the EP4CE75U19I7N depends on the design complexity, clocking scheme, and placement. However, Intel claims a maximum clock frequency of up to 500 MHz.
  • To optimize power consumption, use Intel's PowerPlay power analysis tool, enable power gating, and optimize clock frequencies and voltage levels. Additionally, consider using low-power modes and dynamic voltage and frequency scaling.
  • The EP4CE75U19I7N has 7,257,344 bits of on-chip memory, which can be configured as RAM, ROM, or FIFOs.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

EP4CE75U19I7N Overview

Use the download button to access the EP4CE75U19I7N schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like EP4CE, or try a keyword search, such as Field Programmable Gate Arrays

Parts related to EP4CE75U19I7N

Showing 0 results

EP4CE75U19I7N Alternates

Showing results

Image Part Number Model
Part Image EP4CE75U19I7N Altera Corporation

Field Programmable Gate Array, 75408-Cell, PBGA484