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FDB8447L - onsemi

Description: Fast Switching ; Max rDS(on) = 11mΩ at VGS = 4.5V, ID = 11A ; RoHS compliant ; Max rDS(on) = 8.5mΩ at VGS = 10V, ID = 14A

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PCB Footprints
FDB8447L - onsemi PCB footprint - Other - Other - D2PAK−3 (TO−263, 3−LEAD) CASE 418AJ ISSUE F_2026-1.19
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FDB8447L Details

  • Manufacturer Part Number:

    FDB8447L

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    D2PAK-3 / TO-263-2

  • Package Description:

    TO-263AB, 3/2 PIN

  • Manufacturer Package Code:

    418AJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    153 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    15 A

  • Drain-source On Resistance-Max:

    0.0085 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    60 W

  • Pulsed Drain Current-Max (IDM):

    100 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDB8447L Frequently Asked Questions (FAQs)

  • The FDB8447L can operate from -40°C to 150°C, making it suitable for high-reliability applications.
  • The FDB8447L requires a bias voltage of 2.5V to 5.5V, and the recommended bias current is 10mA to 20mA. Ensure the bias voltage is stable and within the recommended range for optimal performance.
  • To minimize EMI and noise, use a multi-layer PCB with a solid ground plane, keep the FDB8447L away from noise sources, and use short, direct traces for the input and output signals. Additionally, use a common-mode choke or ferrite bead to filter out high-frequency noise.
  • The FDB8447L has a thermal pad on the bottom of the package. Ensure good thermal contact between the thermal pad and a heat sink or thermal interface material to dissipate heat efficiently. Use a thermal design that allows for adequate airflow and heat dissipation.
  • The recommended soldering conditions for the FDB8447L are: peak temperature of 260°C, soldering time of 10 seconds, and a soldering iron temperature of 350°C. Use a solder with a melting point of 217°C to 220°C.

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FDB8447L Overview

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Part Image FDB8447L Rochester Electronics LLC

15A, 40V, 0.0085ohm, N-CHANNEL, Si, POWER, MOSFET, TO-263AB, TO-263AB, 3 PIN