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FMB5551 - onsemi

Description: This device is designed for general purpose high voltage amplifiersand gas discharge display driving.; Sourced from process 16.; See MMBT5551 for characteristics.NPN General Purpose Amplifier SuperSOT-6 Surface Mount Package

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PCB Footprints
FMB5551 - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSOT-23 CASE419AG-01 ISSUE O
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3D Models
FMB5551 - onsemi  - 3D model - SOT23 (6-Pin) - TSOT-23 CASE419AG-01 ISSUE O
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FMB5551 Details

  • Manufacturer Part Number:

    FMB5551

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOT-23-6

  • Package Description:

    SUPERSOT-6

  • Manufacturer Package Code:

    419BL

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.6 A

  • Collector-Emitter Voltage-Max:

    160 V

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • DC Current Gain-Min (hFE):

    30

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.7 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

FMB5551 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • The maximum allowed voltage on the VIN pin is 28V, but it's recommended to keep it below 24V for optimal reliability and performance.
  • Yes, but ensure proper thermal management and PCB design. The device can handle high currents, but excessive heat can reduce its lifespan.
  • Use a systematic approach: check the power supply, verify the input voltage, and monitor the output voltage. Use oscilloscopes and logic analyzers to debug the circuit.

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FMB5551 Overview

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Part Image FMB5551 Fairchild Semiconductor Corporation

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Part Image FMB5551_NL Fairchild Semiconductor Corporation

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