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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IHLP2525CZER1R0M1A
- Part Number IHLP2525CZER1R0M1A
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
IHLP2525CZER1R0M1A Details
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Manufacturer Part Number:
IHLP2525CZER1R0M1A
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
7.9
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Case/Size Code:
2525
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Construction:
Rectangular
IHLP2525CZER1R0M1A Frequently Asked Questions (FAQs)
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The recommended land pattern for IHLP2525CZER1R0M1A is available in the Vishay Intertechnologies' Land Pattern Recommendation document, which can be found on their website. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
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Thermal management is critical for IHLP2525CZER1R0M1A. Ensure good airflow around the component, and consider using a heat sink or thermal interface material (TIM) to reduce thermal resistance. The datasheet provides thermal impedance information to help with thermal design. Additionally, follow Vishay's application notes for thermal management guidelines.
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Yes, IHLP2525CZER1R0M1A is designed to withstand high-vibration environments. However, it's essential to follow Vishay's guidelines for vibration testing and ensure that the component is properly secured to the PCB using recommended mounting techniques.
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To ensure reliability in high-temperature applications, follow Vishay's guidelines for temperature derating, and ensure that the component operates within its specified temperature range. Additionally, consider using a thermally conductive adhesive or thermal interface material to improve heat transfer.
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The recommended soldering profile for IHLP2525CZER1R0M1A is available in the Vishay Intertechnologies' Soldering Profile document, which can be found on their website. The document provides detailed information on the recommended soldering temperature, time, and other parameters for optimal solder joint reliability.
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IHLP2525CZER1R0M1A Overview
Use the download button to access the IHLP2525CZER1R0M1A 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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