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IR2130PBF - Infineon

Description: Half-Bridge Gate Driver IC Inverting 28-PDIP

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Symbol
IR2130PBF - Infineon - PCB symbol
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PCB Footprints
IR2130PBF - Infineon PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 28-LEAD PDIP
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3D Models
IR2130PBF - Infineon - 3D model - Dual-In-Line Packages - 28-LEAD PDIP
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IR2130PBF Details

  • Manufacturer Part Number:

    IR2130PBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDIP-T28

  • Length:

    37.405 mm

  • Number of Functions:

    3

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    PUSH-PULL

  • Output Peak Current Limit-Nom:

    0.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP28,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    6.35 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Supply Voltage1-Max:

    620 V

  • Supply Voltage1-Min:

    5 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    NO

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.55 µs

  • Turn-on Time:

    0.85 µs

  • Width:

    15.24 mm

IR2130PBF Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the IR2130PBF is 500 kHz, but it can be operated up to 1 MHz with reduced performance.
  • Proper thermal management can be achieved by providing a heat sink, ensuring good airflow, and keeping the device away from heat sources. The thermal pad on the bottom of the package should be connected to a copper plane on the PCB to dissipate heat.
  • The recommended layout and routing for the IR2130PBF involves keeping the high-frequency signals away from the low-frequency signals, using a solid ground plane, and minimizing the length of the traces to reduce electromagnetic interference (EMI).
  • The IR2130PBF has built-in overvoltage protection (OVP) and undervoltage protection (UVP) circuits. However, additional protection can be achieved by using external voltage regulators and transient voltage suppressors (TVS) to protect against voltage spikes and surges.
  • The recommended input filtering for the IR2130PBF involves using a low-pass filter (LPF) or a pi-filter (π-filter) to reduce electromagnetic interference (EMI) and radio-frequency interference (RFI). The output filtering can be achieved using a LC filter or a snubber circuit to reduce electromagnetic emissions.

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IR2130PBF Overview

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