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ISL32601EFBZ - Renesas Electronics

Description: The ISL32600E, ISL32601E, ISL32602E, and ISL32603E are ±15kV IEC61000 ESD protected, micro-power, wide supply range transceivers for differential communication. The ISL32600E and ISL32601E operate with VCC ≥ 2. 7V and have maximum supply currents as low as 100µA with both the transmitter (Tx) and receiver (Rx) enabled. The ISL32602E and ISL32603E operate with supply voltages as low as 1. 8V. These transceivers have very low bus currents, so they present less than a 1/8 unit load to the bus. This allows more

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ISL32601EFBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.15-ren4
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ISL32601EFBZ - Renesas Electronics  - 3D model - Small Outline Packages - M8.15-ren4
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ISL32601EFBZ Details

  • Manufacturer Part Number:

    ISL32601EFBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000001 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.2 V

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    1300 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.12 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    600 ns

  • Width:

    3.9 mm

ISL32601EFBZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL32601EFBZ involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. It's also recommended to place the device close to the signal sources and to use a low-ESR capacitor for the VCC pin.
  • The ISL32601EFBZ requires a single 3.3V power supply, and it's recommended to use a low-dropout linear regulator or a switching regulator with a low noise output. The power sequencing requirement is to power up the VCC pin before the SCL and SDA pins.
  • The maximum cable length supported by the ISL32601EFBZ is approximately 1.5 meters. If a longer cable length is needed, it's recommended to use a repeater or a signal conditioner to boost the signal and maintain signal integrity.
  • To troubleshoot issues with the ISL32601EFBZ, check the power supply voltage, signal integrity, and clock frequency. Use an oscilloscope to verify the signal waveforms and check for any noise or distortion. Also, verify that the device is properly configured and that the I2C bus is not overloaded.
  • The ISL32601EFBZ has a maximum junction temperature of 150°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pads on the package. Also, minimize the power consumption by optimizing the device configuration and reducing the clock frequency when possible.

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ISL32601EFBZ Overview

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