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ISL83080EIBZ - Renesas Electronics

Description: The ISL8308xE are BiCMOS, ESD protected, 5V powered, single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. Each driver output, and receiver input, is protected against ±15kV ESD strikes without latch-up, and unlike competitive products, this Intersil family is specified for 10% tolerance supplies (4. 5V to 5. 5V). These devices have very low bus currents (+125µA/-75µA), so they present a true 1/8 unit load to the RS-485 bus. This allows up to 256 transceivers on the

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ISL83080EIBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M14.15 14 LEAD NARROW BODY
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ISL83080EIBZ - Renesas Electronics  - 3D model - Small Outline Packages - M14.15 14 LEAD NARROW BODY
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ISL83080EIBZ Details

  • Manufacturer Part Number:

    ISL83080EIBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    M14.15

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-10-20

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    1.5 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.004 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    150 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.7 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1300 ns

  • Width:

    3.9 mm

ISL83080EIBZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a decoupling capacitor (e.g., 10uF) close to the device's power pins.
  • Monitor the device's junction temperature (TJ) and ensure it stays within the recommended range (-40°C to 125°C). Also, ensure the input voltage (VIN) is within the recommended range (1.8V to 5.5V) and the output voltage (VOUT) is within the specified range (0.8V to 3.3V).
  • A 10uF to 22uF ceramic capacitor (X5R or X7R dielectric) is recommended for the input capacitor (CIN). This value provides a good balance between noise filtering and stability.
  • A 10uF to 22uF ceramic capacitor (X5R or X7R dielectric) is recommended for the output capacitor (COUT). The output capacitor value depends on the output voltage and load current. A larger capacitor value can improve output voltage stability, but may increase the startup time.
  • Place the inductor (L) close to the device's pins, with the capacitors (CIN and COUT) nearby. Keep the high-current paths (e.g., from VIN to L to COUT) short and wide to minimize resistance and inductance. Use a symmetrical layout to reduce electromagnetic interference (EMI).

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