Description:The ISL88731C is a highly integrated Lithium-ion battery charger controller, programmable over the SMBus system management bus (SMBus). The ISL88731C is intended to be used in a smart battery charger (SBC) within a smart battery system (SBS) that throttles the charge power such that the current from the AC-adapter is automatically limited. High efficiency is achieved with a DC/DC synchronous-rectifier buck converter, equipped with diode emulation for enhanced light load efficiency and system bus boosting pr
5 X 5 MM, 0.80 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TQFN-28
Pin Count:
28
Manufacturer Package Code:
L28.5X5B
ECCN Code:
EAR99
HTS Code:
8542.39.00.60
Manufacturer:
Renesas Electronics Corporation
YTEOL:
0
Adjustable Threshold:
NO
Analog IC - Other Type:
LINEAR BATTERY CHARGER
JESD-30 Code:
S-PQCC-N28
JESD-609 Code:
e3
Length:
5 mm
Moisture Sensitivity Level:
3
Number of Channels:
1
Number of Functions:
1
Number of Terminals:
28
Operating Temperature-Max:
100 °C
Operating Temperature-Min:
-10 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
HVQCCN
Package Shape:
SQUARE
Package Style:
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
0.8 mm
Supply Voltage-Max (Vsup):
26 V
Supply Voltage-Min (Vsup):
8 V
Supply Voltage-Nom (Vsup):
18 V
Surface Mount:
YES
Temperature Grade:
OTHER
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
NO LEAD
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Width:
5 mm
ISL88731CHRTZ-T Frequently Asked Questions (FAQs)
A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides some guidelines, but a more detailed application note from Renesas provides additional recommendations.
To ensure reliable operation across the entire operating temperature range, it's essential to follow the recommended operating conditions, including voltage and current ratings. Additionally, consider using thermal management techniques, such as heat sinks or thermal interfaces, to maintain a safe junction temperature.
For EMI and EMC compliance, consider using a shielded layout, minimizing loop areas, and using decoupling capacitors to reduce noise. Additionally, follow the recommended layout guidelines for the device, and consider using EMI filters or common-mode chokes to reduce emissions.
To troubleshoot issues with the device, start by reviewing the datasheet and application notes for common pitfalls and troubleshooting guidelines. Use oscilloscopes or logic analyzers to monitor signals and identify potential issues. Also, consider using Renesas' evaluation boards or development kits to test and validate the design.
When using the device in a high-reliability or safety-critical application, consider the device's fault tolerance, redundancy, and fail-safe mechanisms. Ensure that the device is used within its recommended operating conditions, and follow relevant industry standards and guidelines for safety-critical designs.
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Manufacturer Collaborated
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System Verified
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Community Approved
Sponsored
ISL88731CHRTZ-T Overview
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