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LMC6482IMM - Texas Instruments

Description: OpAmpIC

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LMC6482IMM - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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LMC6482IMM Details

  • Manufacturer Part Number:

    LMC6482IMM

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Date Of Intro:

    1997-11-01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000004 µA

  • Bias Current-Max (IIB) @25C:

    0.000004 µA

  • Common-mode Reject Ratio-Min:

    70 dB

  • Common-mode Reject Ratio-Nom:

    82 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000002 µA

  • Input Offset Voltage-Max:

    750 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e0

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Min:

    0.63 V/us

  • Slew Rate-Nom:

    1.3 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    1.4 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Unity Gain BW-Nom:

    1500

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3 mm

LMC6482IMM Frequently Asked Questions (FAQs)

  • The maximum power dissipation of the LMC6482IMM is 670mW, which is calculated based on the maximum junction temperature (TJ) of 150°C and the thermal resistance (θJA) of 125°C/W.
  • To ensure stability, it's essential to follow proper compensation techniques, such as adding a capacitor in parallel with the feedback resistor to reduce the gain-bandwidth product. Additionally, ensure that the feedback loop has a sufficient phase margin to prevent oscillations.
  • For optimal performance, use a star-grounding technique, where all grounds are connected to a single point. Keep the input and output traces short and away from noise sources. Use a ground plane to reduce electromagnetic interference (EMI) and ensure that the op-amp is decoupled from the power supply using bypass capacitors.
  • The LMC6482IMM is rated for operation up to 125°C, but its performance may degrade at higher temperatures. If you need to operate the device in a high-temperature environment, ensure that you follow proper thermal management techniques, such as using a heat sink or a thermally conductive material.
  • To minimize EMI, use shielding, filtering, and grounding techniques. Keep the op-amp and its associated components away from noise sources, and use twisted pairs or shielded cables for signal transmission. Additionally, use a common-mode choke or a ferrite bead to filter out high-frequency noise.

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LMC6482IMM Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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