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LMC8101TP/NOPB - Texas Instruments

Description: Rail-to-Rail Input and Output, 2.7V Op Amp in micro SMD package with Shutdown

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LMC8101TP/NOPB - Texas Instruments PCB footprint - BGA - BGA - YPB0008_2021
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LMC8101TP/NOPB - Texas Instruments  - 3D model - BGA - YPB0008_2021
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LMC8101TP/NOPB Details

  • Manufacturer Part Number:

    LMC8101TP/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.000064 µA

  • Bias Current-Max (IIB) @25C:

    0.000064 µA

  • Common-mode Reject Ratio-Min:

    64 dB

  • Common-mode Reject Ratio-Nom:

    87 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    0.000032 µA

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    S-PBGA-B8

  • JESD-609 Code:

    e1

  • Length:

    1.4335 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA8,3X3,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.545 mm

  • Slew Rate-Min:

    0.8 V/us

  • Slew Rate-Nom:

    1 V/us

  • Supply Current-Max:

    1 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    1000

  • Voltage Gain-Min:

    560

  • Wideband:

    NO

  • Width:

    1.4335 mm

LMC8101TP/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using bypass capacitors to reduce noise and oscillations.
  • To ensure stability, it's essential to follow the recommended compensation network, use a stable input voltage, and minimize parasitic capacitances. Additionally, the datasheet provides guidelines for selecting the compensation components and calculating the gain-bandwidth product.
  • The maximum power dissipation of the LMC8101 is dependent on the package type and ambient temperature. The datasheet provides a formula to calculate the maximum power dissipation based on the junction temperature, thermal resistance, and ambient temperature.
  • Yes, the LMC8101 can be used as a unity-gain buffer. However, it's essential to ensure that the input impedance is matched to the source impedance, and the output impedance is matched to the load impedance to prevent signal reflections and distortion.
  • The LMC8101 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Additionally, the datasheet provides guidelines for protecting the device from overvoltage conditions using external components such as TVS diodes and resistors.

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LMC8101TP/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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