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LMP7702MM - Texas Instruments

Description: Op Amp

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LMP7702MM - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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LMP7702MM Details

  • Manufacturer Part Number:

    LMP7702MM

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0004 µA

  • Bias Current-Max (IIB) @25C:

    0.000001 µA

  • Common-mode Reject Ratio-Min:

    92 dB

  • Common-mode Reject Ratio-Nom:

    138 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    220 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e0

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6.6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.09 mm

  • Slew Rate-Nom:

    1 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    2.1 mA

  • Supply Voltage Limit-Max:

    6.6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Unity Gain BW-Nom:

    2500

  • Voltage Gain-Min:

    50100

  • Wideband:

    NO

  • Width:

    3 mm

LMP7702MM Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact layout with the LMP7702MM placed close to the analog signal sources, and the use of a solid ground plane to minimize noise and EMI. Additionally, it's recommended to keep the input and output traces short and away from digital signals.
  • To optimize the performance of the LMP7702MM in high-frequency applications, it's recommended to use a low-ESR capacitor for the power supply bypassing, and to minimize the parasitic inductance and capacitance of the input and output traces. Additionally, the use of a shielded enclosure and a good grounding scheme can help to reduce EMI and noise.
  • The LMP7702MM has an operating temperature range of -40°C to 125°C, but it's recommended to derate the device's performance at temperatures above 85°C to ensure reliable operation.
  • To handle the EMI and RFI susceptibility of the LMP7702MM, it's recommended to use a shielded enclosure, a good grounding scheme, and to keep the input and output traces away from digital signals. Additionally, the use of EMI filters and shielding on the input and output lines can help to reduce the susceptibility to EMI and RFI.
  • The recommended power-up sequence for the LMP7702MM is to power up the VCC pin first, followed by the VIN pin. This ensures that the internal biasing and reference circuits are properly initialized before the input signal is applied.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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