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LMP8602QMAX/NOPB - Texas Instruments

Description: SP Amp Current Sense Amp Single 5.5V Automotive 8-Pin SOIC T/R

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PCB Footprints
LMP8602QMAX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A
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3D Models
LMP8602QMAX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - D0008A
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LMP8602QMAX/NOPB Details

  • Manufacturer Part Number:

    LMP8602QMAX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    INSTRUMENTATION AMPLIFIER

  • Common Mode Voltage-Max:

    60 V

  • Common-mode Reject Ratio-Min:

    90 dB

  • Input Offset Voltage-Max:

    1000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    0.4 V/us

  • Supply Current-Max:

    1.5 mA

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Gain-Nom:

    50

  • Width:

    3.91 mm

LMP8602QMAX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's also recommended to follow general high-frequency PCB design guidelines, such as using a solid ground plane, minimizing trace lengths, and using bypass capacitors to reduce noise and oscillations.
  • To ensure stability, it's essential to follow the recommended compensation network and component values, as well as to ensure that the input and output capacitors are properly selected and placed. Additionally, the device's power supply should be well-regulated and decoupled to prevent noise and oscillations.
  • The maximum power dissipation of the LMP8602QMAX/NOPB is dependent on the operating conditions, such as the input voltage, output current, and ambient temperature. However, as a general guideline, the device is rated for a maximum power dissipation of 1.5W. It's essential to ensure that the device is properly heat-sinked and that the operating conditions are within the recommended specifications.
  • The LMP8602QMAX/NOPB is rated for operation up to 125°C, but it's essential to ensure that the device is properly heat-sinked and that the operating conditions are within the recommended specifications. Additionally, the device's performance and reliability may be affected at high temperatures, so it's recommended to consult with Texas Instruments or a qualified engineer for specific guidance.
  • To troubleshoot issues with the LMP8602QMAX/NOPB, it's recommended to follow a systematic approach, such as checking the power supply, input and output voltages, and component values. Additionally, using oscilloscopes and other diagnostic tools can help identify issues such as oscillations, noise, or instability. It's also recommended to consult the datasheet and application notes, as well as to seek guidance from Texas Instruments or a qualified engineer.

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LMP8602QMAX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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