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LT1021CIN8-5#PBF - Analog Devices

Description: Voltage References Precision Reference

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LT1021CIN8-5#PBF - Analog Devices PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8-Lead PDIP_2024
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LT1021CIN8-5#PBF - Analog Devices  - 3D model - Dual-In-Line Packages - 8-Lead PDIP_2024
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LT1021CIN8-5#PBF Details

  • Manufacturer Part Number:

    LT1021CIN8-5#PBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    0.300 INCH, LEAD FREE, PLASTIC, DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    05-08-1510 (N8)

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    10.16 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    5.0025 V

  • Output Voltage-Min:

    4.9975 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.937 mm

  • Supply Voltage-Max (Vsup):

    40 V

  • Supply Voltage-Min (Vsup):

    7.2 V

  • Supply Voltage-Nom (Vsup):

    10 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temp Coef of Voltage-Max:

    20 ppm/°C

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    YES

  • Width:

    7.62 mm

LT1021CIN8-5#PBF Frequently Asked Questions (FAQs)

  • A good PCB layout for the LT1021 involves keeping the input and output traces short and separate, using a solid ground plane, and placing the input and output capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended compensation network, use a minimum output capacitance of 10uF, and keep the input and output resistors within the recommended range. Also, avoid using long input traces and keep the device away from noise sources.
  • The maximum power dissipation of the LT1021 is dependent on the package type and the ambient temperature. For the IN8 package, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to derate the power dissipation based on the ambient temperature and the thermal resistance of the package.
  • The LT1021 is not suitable for high-current applications. It's designed for low-power, low-noise applications and can only deliver up to 10mA of output current. For high-current applications, consider using a dedicated voltage regulator IC or a switching regulator.
  • To protect the LT1021 from input voltage transients and surges, consider adding a transient voltage suppressor (TVS) diode or a voltage clamp at the input. Additionally, use a input capacitor with a high voltage rating and a low ESR to filter out noise and transients.

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LT1021CIN8-5#PBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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