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LTC2174CUKG-12#TRPBF - Analog Devices

Description: 12-Bit, 105Msps Low Power Quad ADCs

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LTC2174CUKG-12#TRPBF - Analog Devices PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - UKG Package 52-Lead Plastic QFN (7mm × 8mm)
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LTC2174CUKG-12#TRPBF - Analog Devices  - 3D model - Quad Flat No-Lead - UKG Package 52-Lead Plastic QFN (7mm × 8mm)
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LTC2174CUKG-12#TRPBF Details

  • Manufacturer Part Number:

    LTC2174CUKG-12#TRPBF

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    7 X 8 MM, LEAD FREE, PLASTIC, QFN-52

  • Pin Count:

    52

  • Manufacturer Package Code:

    05-08-1729

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Analog Input Voltage-Max:

    2 V

  • Analog Input Voltage-Min:

    -2 V

  • Converter Type:

    ADC, PROPRIETARY METHOD

  • JESD-30 Code:

    R-PQCC-N52

  • JESD-609 Code:

    e3

  • Length:

    8 mm

  • Linearity Error-Max (EL):

    0.0244%

  • Moisture Sensitivity Level:

    1

  • Number of Analog In Channels:

    4

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    52

  • Operating Temperature-Max:

    70 °C

  • Output Bit Code:

    OFFSET BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC52,.27X.31,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Sample Rate:

    105 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    1.8 mA

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

LTC2174CUKG-12#TRPBF Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for optimal performance. Analog Devices recommends a 4-layer PCB with a solid ground plane, and to keep the analog and digital sections separate. Additionally, use short and wide traces for the high-frequency signals, and avoid vias under the device.
  • For optimal performance, the clock signal should be a low-jitter, high-frequency signal (e.g., 100 MHz). Use a clock source with a low phase noise, and ensure the clock signal is properly terminated and routed to minimize reflections and noise.
  • The recommended power-up sequence is to first apply the analog supply voltage (AVCC), followed by the digital supply voltage (DVCC), and finally the clock signal. This sequence helps to ensure proper device initialization and prevents latch-up.
  • The LTC2174CUKG-12#TRPBF has a high power dissipation, so proper thermal management is crucial. Use a heat sink or a thermal pad to dissipate heat, and ensure good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer.
  • The LTC2174CUKG-12#TRPBF is a sensitive device and requires proper ESD protection. Use ESD protection devices such as TVS diodes or ESD arrays on the input and output pins, and ensure that the PCB design follows good ESD protection practices.

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LTC2174CUKG-12#TRPBF Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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